1.3. Release Notes - 01_02_00

1.3.1. Introduction

This release notes provides important information that will assist you in using the SDL software package for the J721E family of devices. This document provides the product information and known issues that are specific to the SDL software package.

New features added / supported is listed below and defects fixed are highlighted in Fixed Issues. Also please check Upgrade and Compatibility for backward compatibility

1.3.2. What’s New

  • 64 bit atomic write supported for MCRC_MCU_NAVSS.

1.3.3. Supported Modules

SDL Support for the following modules is available from previous release:

  • ESM

  • PBIST

  • LBIST

  • POK

  • VTM

  • TOG

  • ECC

  • RTI

  • R5F CCM

  • DCC

  • MCRC

  • ROM CHECKSUM

Safety Examples for the following modules:

  • ESM

  • POK

  • VTM

  • TOG

  • DCC

  • RTI

  • ECC

  • BIST

  • ROM_CHECKSUM

1.3.4. Upgrade and Compatibility

None

1.3.5. Supported Devices

Platform

Supported Devices

Supported EVMs

J721E SR1.1

Functional safety Devices:
DRA829
TDA4VM
DRA829Vx Evaluation Module
(DRA829VXEVM)

1.3.6. Fixed Defects

ID

Summary

Comments

PROC_SDL-6295

mcrc_app waits for UDMA interrupt in loop forever

None

PROC_SDL-6161

A72 Boot Fails after A72 PBIST

None

PROC_SDL-6174

In sdl_mcrc_test_app , return value in sdl_mcrcSemiCPU_udmaCrc API is over written.

None

1.3.7. Open Defects

ID

Summary

Workaround

PROC_SDL-6298

sdl_pok_test_app fails for SDL_POK_VMON_EXT_OV_ID instance

None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application.

PROC_SDL-6349

SDL ECC error injection test fails for certain IPs in ecc_func_app SDL_CBASS_ECC_AGGR0

None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application. The IP associated with the ECC aggregator may need some additional power/init sequence.

PROC_SDL-6348

SDL ECC error injection test fails for certain IPs in ecc_func_app SDL_ECC_MEMTYPE_MCU_CBASS_ECC_AGGR0

None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application. The IP associated with the ECC aggregator may need some additional power/init sequence.

PROC_SDL-6297

SDL ECC error injection test fails for certain IPs in ecc_func_app SDL_MAIN_RC_ECC_AGGR0

None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application. The IP associated with the ECC aggregator may need some additional power/init sequence.

PROC_SDL-6929

MCRC 64 bit atomic write not supported on MCRC Instance in Navigator Sub System(NAVSS) domain

None - This issue is under investigation.

PROC_SDL-6924

mpu_test_app fails in release mode when tested in thumb mode.

None - This issue is under investigation.

PROC_SDL-6925

pmu_test_app fails in release mode when tested in thumb mode.

None - This issue is under investigation.

1.3.8. Migration Information

Dependency on C7X image is removed for compute cluster instances. PBIST example, pbist_test_app and sdl_pbist_test_app can be tested as standalone images.

1.3.9. Tool Chain Information

Component

Version

TI ARM R5F Clang Compiler tools

3.2.0.LTS