1.5. Release Notes - 01_00_01

1.5.1. Introduction

This release notes provides important information that will assist you in using the SDL software package for the J721E family of devices. This document provides the product information and known issues that are specific to the SDL software package.

New features added / supported is listed below and defects fixed are highlighted in Fixed Issues. Also please check Upgrade and Compatibility for backward compatibility

1.5.2. What’s New

Update SDL to support PDK 8.6.0.

SDL Support for the following modules is available from previous release:

  • ESM

  • PBIST

  • LBIST

  • POK

  • VTM

  • TOG

  • ECC

  • RTI

  • R5F CCM

  • DCC

  • MCRC

Safety Examples for the following modules:

  • ESM

  • POK

  • VTM

  • TOG

  • DCC

  • RTI

  • ECC

  • BIST

1.5.3. Supported Platforms

Platform

Supported Devices

Supported EVMs

J721E SR1.1

Functional safety Devices:
DRA829
TDA4VM
DRA829Vx Evaluation Module
(DRA829VXEVM)

1.5.4. Fixed Issues

None

1.5.5. Known Issues and Limitations

Issue Id

Description

Workaround

PROC_SDL-1956

PBIST test case for DSS/EDP/DSI fails

None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application.

PROC_SDL-1955

SDL_PBIST_selfTest for GPU Instance with golden vectors fails

None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application.

PROC_SDL-2417

SDL ECC error injection test fails for certain IPs (PCIE, DSS/eDP/DSI, CSITX/RX, I3C) Metadata incomplete for certain IPs also (CPSW, OSPI, HPB)

None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application. The IP associated with the ECC aggregator may need some additional power/init sequence.

PROC_SDL-5680

esm_test_app fails in sdlEsm_negTest

None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application.

PROC_SDL-5681

pok_app fails with continouos callback.

None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application.

PROC_SDL-5682

sdl_ecc_test_app fails for VIM module.

None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application.

PROC_SDL-5683

sdl_pok_test_app fails for POK_VMON_EXT_OV

None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application.

PROC_SDL-5684

SDL ECC error injection test fails for MSRAM32KX256E because of Metadata incomplete

None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application.

PROC_SDL-5685

esm_wkup_mcu_app and vtm_app tests fail.

None - This issue is under investigation.

PROC_SDL-5686

mpu_func_test_app fail.

None - This issue is under investigation.

PROC_SDL-5687

sdl_vtm_test_app fails.

None - This issue is under investigation.

PROC_SDL-5689

bist_example failing in Main Infra1 and Main R5F 1 PBIST instances.

Use pbist_test_app or sdl_pbist_test_app

1.5.6. Migration Information

None

1.5.7. Tool Chain Information

Component

Version

TI ARM R5F Clang Compiler tools

1.3.0.LTS