1.6. Release Notes - 01_00_00

1.6.1. Introduction

This release notes provides important information that will assist you in using the SDL software package for the J721E family of devices. This document provides the product information and known issues that are specific to the SDL software package.

New features added / supported is listed below and defects fixed are highlighted in Fixed Issues. Also please check Upgrade and Compatibility for backward compatibility

1.6.2. What’s New

SDL Support for the following modules are added:

• R5F PMU, MPU, RAT and VIM

SDL Support for the following modules is available from previous release:

• ESM

• PBIST

• LBIST

• POK

• VTM

• TOG

• ECC

• RTI

• R5F CCM

• DCC

• MCRC

Safety Examples for the following modules:

• ESM

• POK

• VTM

• TOG

• DCC

• RTI

• ECC

• BIST

1.6.3. Supported Platforms

Platform	Supported Devices	Supported EVMs
J721E SR1.1	Functional safety Devices: DRA829 TDA4VM	DRA829Vx Evaluation Module (DRA829VXEVM)

1.6.4. Fixed Issues

None

1.6.5. Known Issues and Limitations

Issue Id	Description	Workaround
PROC_SDL-1956	PBIST test case for DSS/EDP/DSI fails	None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application.
PROC_SDL-1955	SDL_PBIST_selfTest for GPU Instance with golden vectors fails	None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application.
PROC_SDL-2417	SDL ECC error injection test fails for certain IPs (PCIE, DSS/eDP/DSI, CSITX/RX, I3C) Metadata incomplete for certain IPs also (CPSW, OSPI, HPB)	None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application. The IP associated with the ECC aggregator may need some additional power/init sequence.

1.6.6. Migration Information

None

1.6.7. Tool Chain Information

Component	Version
TI ARM R5F Clang Compiler tools	1.3.0.LTS