2.1. Release Notes

2.1.1. Overview

The Processor Software Development Kit (Processor SDK) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly reuse and develop software across devices. Developing a scalable platform solutions has never been easier than with the Processor SDK and TI’s embedded processor solutions.

To simplify the user experience, Processor SDK Linux AM62Px installer provides everything needed as discussed below to create the embedded system from “scratch” :

  • Platform/board-support software and configuration files for Linux

  • U-Boot and Kernel sources and configuration files

  • An ARM cross-compiling toolchain as well as other host binaries and components

  • A Yocto/OE compliant filesystem and sources for example applications

  • A variety of scripts and Makefiles to automate certain tasks

  • Other components needed to build an embedded system that don’t fit neatly into one of the above buckets

  • Reference Examples, benchmarks

This release supports High Security - Field Securable (HS-FS) devices.

2.1.2. Release versioning scheme

Processor SDK releases follow the 5-duplet versioning scheme YY.RR.EE.CC.SS, where:

  • YY - Yearly baseline. Increments with each new LTS baseline.

  • RR - Release index within the yearly baseline. Each yearly baseline includes many stable releases.

  • EE - Extended release index within a stable baseline.

  • CC - Release Candidate for common foundational BSP components such as Linux, U-Boot, ATF, OPTEE, Firmware and OE manifest including meta-ti, meta-arago.

  • SS - SDK Release identifier for Distro layers (Yocto meta-tisdk, Armbian, Buildroot) with OOB Demos and Installers.

2.1.3. Licensing

Please refer to the software manifests, which outlines the licensing status for all packages included in this release. The manifest can be found on the SDK download page or in the installed directory as indicated below.

2.1.4. Software Bill of Materials (SBOM)

Processor SDK Linux AM62Px releases include Software Bill of Materials (SBOM) files in SPDX 3.0 format by default. SBOMs for all released artifacts are bundled into a single archive and can be found on the AM62Px-SDK-Download-page. For more refer Working with SBOM.

2.1.5. Release 12.00.00.07.04

Released on Apr 2026

2.1.5.1. What’s new

Processor SDK Linux AM62PX Release has following new features:

  • First 2026 LTS Reference Release Including RT combined branch model

  • Important Bug Fixes on top of Processor SDK 11.02.08.02 Release.

  • Review Issue Tracker Section for the new fixes.

  • Security: ATF and OPTEE memory firewall for isolation from Linux

  • Security: Yocto reference for LUKS2 root filesystem encryption with fTPM key management

  • Power: Reduced power consumption using MCU Only low power mode by 35%

Key Release References:

Component version:

  • Kernel 6.18.13

  • U-Boot 2026.01

  • Toolchain GCC 15.2

  • ATF 2.14+

  • OPTEE 4.9.0+

  • TIFS Firmware v12.00.02 (Click on the link for more information)

  • Yocto Master

  • Security: Post Quantum Cryptography using Module Lattice (ML) Key Encapsulation Mechanism (KEM) or ML-KEM, ML Digital Signature Algorithm (DSA) or ML-DSA, and Stateless Hash-Based (SLH) DSA or SLH-DSA - Post Quantum Cryptography

  • Graphics DDK 25.3

  • DM Firmware 12.00.00.09

2.1.6. Build Information

2.1.6.1. Arago (Yocto/OE)

Component

Branch Info

Tag Info

Config Info

U-Boot

ti-u-boot-2026.01

12.00.00.07

Build Config

TF-A

master

v2.14+

OPTEE

master

4.9.0+

k3-am62px

Linux Firmware

ti-linux-firmware

12.00.00.07

Linux Kernel

ti-linux-6.18.y

12.00.00.07

non-RT , RT

meta-ti

master

12.00.00.07

am62pxx-evm

meta-arago

master

12.00.00.07

meta-tisdk

master

12.00.00.07.04

2.1.6.2. Debian (Armbian)

Component

Branch Info

Tag Info

Config Info

U-Boot

ti-u-boot-2026.01

12.00.00.07

Build

TF-A

master

v2.14+

Build

OPTEE

master

4.9.0+

Build

Linux Firmware

ti-linux-firmware

12.00.00.07

Git Clone

Linux Kernel

ti-linux-6.18.y

12.00.00.07

non-RT, RT

Armbian Build

2026.04-release

12.00.00.07.04

Board: SK-AM62P

2.1.7. Issues Tracker

Note

  • Release Specific Issues including details will be published through Software Incident Report (SIR) portal

  • Further Information can be found at SIR Portal

2.1.7.1. Errata Resolved

Record ID

Title

EXT_EP-12128

USB2 PHY locks up due to short suspend

EXT_EP-12124

BCDMA: RX Channel can lockup in certain scenarios

EXT_EP-12114

MMCSD: HS200 and SDR104 Command Timeout Window Too Small

EXT_EP-12294

MMCHS: eMMC HS400 tDCD timing marginal to JEDEC spec

2.1.7.2. Errata Open

Record ID

Title

EXT_EP-13304

U-Boot: MMCSD HS200 Write Failures

2.1.7.3. Issues Resolved

Record ID

Title

EXT_EP-13152

AM62A/AM62P: Gstreamer V4L2allocator CMA leak.

EXT_EP-13314

AM62Lx Linux SDK documentation on CPSW XDP points to PRU-ICSSG XDP

EXT_EP-13131

MMCSD: PHY DLL frequency is setting incorrectly for any clock < 200MHz

EXT_EP-13316

Board fails to resume after multiple iterations of MCU Only LPM

EXT_EP-13321

gstreamer 1.26.9: v4l2src format negotiation fails with capsfilter constraints

EXT_EP-13303

Kernel: MMCSD HS200 Write Failures

EXT_EP-13144

Job_ready false reporting ready state too frequently in Wave5 driver

2.1.7.4. Issues Open

Record ID

Title

EXT_EP-13320

PowerVR Vulkan driver crash using MPV