TI BLE-Stack for Bluetooth 4.2 API Documentation  3.01.00.07
Modules | Macros
GAP Bond Manager Constants

Modules

 Bonding Failure Actions
 
 GAP Bond Manager ECC Re-use count before regeneration
 
 GAP Bond Manager I/O Capabilities
 
 GAP Bond Manager Key Distribution
 
 GAP Bond Manager Pairing Modes
 
 GAP Bond Manager Pairing States
 
 GAP Bond Manager Parameters
 
 GAP Bond Manager Secure Connections options
 
 Pairing failure status values
 
 SM AuthReq Bonding Flags
 
 SM I/O Capabilities
 
 SM Message opcocdes
 
 SM Passkey Types (Bit Masks)
 

Macros

#define ECC_KEYLEN   32
 256 bit keys
 
#define GAP_BONDINGS_MAX   10
 Maximum number of bonds that can be saved in NV.
 
#define GAP_CHAR_CFG_MAX   4
 Maximum number of characteristic configuration that can be saved in NV.
 
#define PASSKEY_LEN   6
 Passkey Character Length (ASCII Characters)
 
#define SM_AUTH_MITM_MASK(a)   (((a) & 0x04) >> 2)
 MITM Mask.
 
#define SM_AUTH_STATE_AUTHENTICATED   0x04
 Authenticate requested.
 
#define SM_AUTH_STATE_BONDING   0x01
 Bonding requested.
 
#define SM_AUTH_STATE_SECURECONNECTION   0x08
 Secure Connection requested.
 
#define SM_ECC_KEY_LEN   32
 ECC Key length in bytes.
 
#define SM_ECC_KEYS_NOT_AVAILABLE   0xFF
 Initial state of recycled keys before they exist.
 
#define SM_ECC_KEYS_REGENERATE_ALWAYS   0x00
 Always regenerate the keys.
 
#define SM_ECC_KEYS_REGNENERATE_NEVER   0xFF
 Never regenerate the keys.
 

Detailed Description

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