TI BLE5-Stack 3.03.01.00 Release Notes
Table of Contents
- Introduction
- BLE5-Stack Documentation
- Installation and Usage
- What’s New
- Fixed Issues
- Known Issues and Limitations
- Upgrade and Compatibility Information
- Qualification
- Dependencies
- Device Support
- Development Board Support
- Versioning
- Product Security Vulnerabilities
- Technical Support and Product Updates
Introduction
The BLE5-Stack is a set of sample applications, tools, APIs and protocol stack libraries that enable engineers to develop Bluetooth ® 5 standalone or network processor LE applications on the SimpleLink™ CC23xx family of wireless MCUs.
Key features overview of BLE5-Stack 3.03.01.00:
| BLE Features | Support Status |
|---|---|
| Legacy advertising | Supported |
| Connection using the LE 1M PHY | Supported |
| Pairing and link encryption | Supported |
| Bonding | Supported |
| Accept list for advertiser | Supported |
| Direct Test Mode (DTM) | Supported |
| L2CAP Connection Oriented Channels (CoC) | Supported |
| Extended advertising | Early Access (not yet Bluetooth certified) |
| LE 2M and Coded PHYs | Supported |
| Privacy | Supported |
| Adjustable TX Power | Supported |
| RSSI Reading | Supported |
| Over The Air Download | Supported |
| LE Secure Connection | Supported |
| Data Length Extension (DLE) | Supported |
| Periodic Advertising | Not Supported (Planned for a future release) |
| Direction Finding (AoA) | Not Supported (Planned for a future release) |
The BLE5-Stack provides a set of basic examples designed to accelerate customer product development providing easy-to-use, out-of-the-box demonstrations of the full hardware capabilities.
| Available Examples | Description |
|---|---|
| basic_ble | Example project where device can be configured to operate as a Bluetooth LE peripheral, central, or both. |
| basic_ble_oad_offchip | Same as basic_ble above with OAD off-chip functionality to enable wireless firmware updates. |
| basic_ble_oad_onchip | Same as basic_ble above with OAD on-chip functionality to enable wireless firmware updates. |
| basic_ble_profiles | Same as basic_ble above with additional custom profiles included in project. Example currently contains the TI Simple Profile, Continuous Glucose Monitoring profile, Glucose profile & Health Thermometer profile |
| basic_ble_ptm | Same as basic_ble above with Production Test Mode (PTM) functionality. |
| basic_dual_image | Same as basic_ble above with OAD dual image functionality. |
| basic_persistent | Permanently resident application that implements OAD profile |
| connection_monitor | Example project that implements high level connection tracking. |
| data_stream | Example project which implements data stream profile to enable UART over Bluetooth LE. |
| host_test | Example project which can be used with Bluetooth Tester through UART or SPI. |
Additional information about TI’s Bluetooth Low Energy solutions can be found at www.ti.com/ble
BLE5-Stack Documentation
The SimpleLink™ Low Power F3 Software Development Kit (SDK) allows easier product development by combining TI-drivers and the Bluetooth LE protocol stack in one unified SDK. All BLE5-Stack sample applications are based off the FreeRTOS Kernel. Key documents needed for Bluetooth LE application development include:
Installation and Usage
- To build the sample applications with this SDK a supported Integrated Development Environment (IDE) must be installed (refer to Dependencies below)
- Install the simplelink_lowpower_f3_sdk_8_10_01_xx installer package on a supported host operating system build machine with Administrator privileges
- The default install path for Windows is C:\ti\simplelink_lowpower_f3_sdk_8_10_01_xx
- Changing the default install path and/or drive letter may require updating project variables. Do not use a space in the install path
- It is recommended to make a backup of the installation in order to revert modifications to the SDK
The following sections only mention the changes introduced between F3 SDK 8.10.00.55 and 8.10.01.xx releases.
What’s New
- This point release implements minor bugfixes & limited changes.
| ID | Summary |
|---|---|
| None | None |
Fixed Issues
| ID | Summary |
|---|---|
| BLE_LOKI-1893 | The host_test example fails to build on Linux/MacOS |
| BLE_LOKI-1848 | When using same value for Scan Window and Scan Interval, the interval size is not accurate |
| BLE_LOKI-1578 | After multiple GATT data transmissions, a blePending error was return. |
Known Issues and Limitations
| ID | Summary |
|---|---|
| None | None |
Upgrade and Compatibility Information
The BLE5-Stack 3.03.01.00 supports the following devices:
- SimpleLink CC2340R2 devices with silicon revision A
- SimpleLink CC2340R22 devices with silicon revision B
- SimpleLink CC2340R5 devices with silicon revision B
- SimpleLink CC2340R5-Q1 devices with silicon revision B
No support for previous silicon revisions or LaunchPad™ development kits using earlier silicon revision. If you’re unsure of the revision number of your device, please see the Package Symbolization and Revision Identification section of the Errata Note.
Qualification
The Bluetooth Low Energy software stack (BLE5-Stack) for CC23xx Bluetooth LE-enabled wireless MCUs uses Bluetooth Qualified Components, which allow device integrators to substantially reduce the testing required to meet Bluetooth end product listing (EPL) qualification requirements while providing flexibility to the device configuration. Bluetooth SIG rules specify that Qualified Components have a validity period of three (3) years at which time they may not be available for new End Product Listings (EPLs). The applicable QDID for this release is QDID 201833
Warning: Extended advertising is not yet qualified.
For information on the qualification process, please refer to https://www.ti.com/ble-qualification
Dependencies
See top-level release notes for overall SDK dependencies
Device Support
This release supports development of single-mode Bluetooth LE applications on 2.4 GHz wireless MCUs listed in the top-level SDK release
Development Board Support
This release supports development of single-mode Bluetooth LE on 2.4 GHz wireless MCU development kits listed in the top-level SDK release notes.
Versioning
This product follows a version format, M.mm.pp.bb, where:
- M is a 1 digit major number,
- mm is a 2 digit minor number,
- pp is a 2 digit patch number,
- bb is a 2 digit incrementing build counter.
Product Security Vulnerabilities
- Vulnerability reports and mitigations can be found on https://www.ti.com/PSIRT`