TI BLE5-Stack 3.03.01.00 Release Notes

Table of Contents

Introduction

The BLE5-Stack is a set of sample applications, tools, APIs and protocol stack libraries that enable engineers to develop Bluetooth ® 5 standalone or network processor LE applications on the SimpleLink™ CC23xx family of wireless MCUs.

Key features overview of BLE5-Stack 3.03.01.00:

BLE Features Support Status
Legacy advertising Supported
Connection using the LE 1M PHY Supported
Pairing and link encryption Supported
Bonding Supported
Accept list for advertiser Supported
Direct Test Mode (DTM) Supported
L2CAP Connection Oriented Channels (CoC) Supported
Extended advertising Not Supported (Work ongoing)
LE 2M and Coded PHYs Supported
Privacy Supported
Adjustable TX Power Supported
RSSI Reading Supported
Over The Air Download Supported
LE Secure Connection Supported
Data Length Extension (DLE) Supported
Periodic Advertising Not Supported (Planned for a future release)
Direction Finding (AoA) Not Supported (Planned for a future release)

The BLE5-Stack provides a set of basic examples designed to accelerate customer product development providing easy-to-use, out-of-the-box demonstrations of the full hardware capabilities.

Available Examples Description
basic_ble Example project where device can be configured to operate as a Bluetooth LE peripheral, central, or both.
basic_ble_oad_offchip Same as basic_ble above with OAD off-chip functionality to enable wireless firmware updates.
basic_ble_oad_onchip Same as basic_ble above with OAD on-chip functionality to enable wireless firmware updates.
basic_ble_profiles Same as basic_ble above with additional custom profiles included in project. Example currently contains the TI Simple Profile, Continuous Glucose Monitoring profile, Glucose profile & Health Thermometer profile
basic_ble_ptm Same as basic_ble above with Production Test Mode (PTM) functionality.
basic_dual_image Same as basic_ble above with OAD dual image functionality.
basic_persistent Permanently resident application that implements OAD profile
connection_monitor Example project that implements high level connection tracking.
data_stream Example project which implements data stream profile to enable UART over Bluetooth LE.
host_test Example project which can be used with Bluetooth Tester through UART or SPI.

Additional information about TI’s Bluetooth Low Energy solutions can be found at www.ti.com/ble

BLE5-Stack Documentation

The SimpleLink™ Low Power F3 Software Development Kit (SDK) allows easier product development by combining TI-drivers and the Bluetooth LE protocol stack in one unified SDK. All BLE5-Stack sample applications are based off the FreeRTOS Kernel. Key documents needed for Bluetooth LE application development include:

Installation and Usage

What’s New

ID Summary
BLE_LOKI-1122 BLE Stack supports Connectable/Scannable Extended Advertising
BLE_LOKI-923 Health Tool Kit

Fixed Issues

ID Summary
BLE_LOKI-1623 Scannable advertiser only responds to single scan request received in advertisement
BLE_LOKI-1443 Gatt Notifications cannot be received on Central after erasing all bonds.
BLE_LOKI-1353 SysConfig error when altering the advertisement parameters in Broadcaster role
BLE_LOKI-1352 Target Address not changing when using directed advertising
BLE_LOKI-1247 [SWAT][Data Stream] Gatt_WriteLongCharValue() calls with size 512 bytes fails when using TI Clang Compiler
BLE_LOKI-1146 Advertisements with Limited Discoverable Flag not terminating within lim_adv_timeout (180 s)
BLE_LOKI-1034 Critical Section order not optimal in ICall_leaveCSImpl & ICall_enterCSImpl functions
BLE_LOKI-949 BLE stack does not remove the att rsp msg even when the BLE connection is lost
ID Summary
BLE_LOKI-1161 [PSIRT] Stack generates unexpected RPA during fuzz attack when using speed optimization

Known Issues and Limitations

ID Summary
BLE_LOKI-1674 Connection Monitor failed to start monitoring after about 6 hours
BLE_LOKI-1672 Scanner may report incorrect Tx Power value for advertiser using advertising sets with different Tx Power values
BLE_LOKI-1661 Peripheral fails to enable legacy adv set 2 after create connection to adv set 1 if they are using different address types.
BLE_LOKI-1653 [AE] In rare cases, when RPA refresh interval is low, a connection may fail to be established
BLE_LOKI-1649 [Extender Advertisement] When using Coded PHY as secondary, only S=8 will be used regardless of configuration
BLE_LOKI-1630 [SCAN_PARAM_FLT_DUP] Extender Advertisement Reports Are Not Filtered When SCAN_PARAM_FLT_DUP is Enabled
BLE_LOKI-1612 [AE] [Initiator] Connection is established with wrong connection parameters when using different PHY's for Primary & Secondary channels

Upgrade and Compatibility Information

The BLE5-Stack 3.03.01.00 supports the following devices:

No support for previous silicon revisions or LaunchPad™ development kits using earlier silicon revision. If you’re unsure of the revision number of your device, please see the Package Symbolization and Revision Identification section of the Errata Note.

Qualification

The Bluetooth Low Energy software stack (BLE5-Stack) for CC23xx Bluetooth LE-enabled wireless MCUs uses Bluetooth Qualified Components, which allow device integrators to substantially reduce the testing required to meet Bluetooth end product listing (EPL) qualification requirements while providing flexibility to the device configuration. Bluetooth SIG rules specify that Qualified Components have a validity period of three (3) years at which time they may not be available for new End Product Listings (EPLs). The applicable QDID for this release is QDID 201833

Warning: Extended advertising is not yet qualified.

For information on the qualification process, please refer to https://www.ti.com/ble-qualification

Dependencies

See top-level release notes for overall SDK dependencies

Device Support

This release supports development of single-mode Bluetooth LE applications on 2.4 GHz wireless MCUs listed in the top-level SDK release

Development Board Support

This release supports development of single-mode Bluetooth LE on 2.4 GHz wireless MCU development kits listed in the top-level SDK release notes.

Versioning

This product follows a version format, M.mm.pp.bb, where:

Product Security Vulnerabilities

Technical Support and Product Updates