TI BLE5-Stack 2.02.02.00 Release Notes
Table of Contents
- Introduction
- BLE5-Stack Documentation
- Installation and Usage
- What’s New
- Fixed Issues
- Known Issues and Limitations
- Upgrade and Compatibility Information
- Qualification
- Operating System Support
- Dependencies
- Device Support
- Development Board Support
- Validation
- Versioning
- Technical Support and Product Updates
Introduction
The BLE5-Stack is a set of sample applications, tools, APIs and protocol stack libraries that enable engineers to develop Bluetooth ® 5 standalone or network processor LE applications on the SimpleLink™ CC13x2 and CC26x2 family of wireless MCUs.
This Bluetooth 5 (BLE5-Stack) release includes qualification for Bluetooth 5.2 in addition to support for the existing core specifications (4.0, 4.1, 4.2) in addition to core specification 5.0 and 5.1 LE features such as: Direction Finding (AoA - Connected and Connectionless CTE), High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125kbps and 500kbps PHYs), Advertisement Extensions (AE), Periodic Advertisements, Privacy 1.2.1 and Channel Selection Algorithm #2.
As with all Bluetooth core specifications that support the Low Energy (LE) feature, devices implementing the LE feature of Bluetooth 5 are backward compatible with Bluetooth 4.2, 4.1 and 4.0 LE capable devices.
BLE5-Stack 2.02.02.00 has been Bluetooth 5.2 qualified and is available for production use.
Key features of BLE5-Stack 2.02.02.00:
- Our new devices CC13x1x, CC26x1x, CC1352P7, CC2652R7 and CC2652RSIP are supported in the examples provided
- Bluetooth 5.2 qualified release for production
- Bluetooth Mesh Profile 1.0.1 is also qualified
- Supports the following Bluetooth 5 LE features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and 500 kbps PHYs), Advertisement Extensions (AE), Periodic Advertisements, Privacy 1.2.1 and Channel Selection Algorithm #2
- Supports the following Bluetooth 5.1 LE features: Direction Finding (AoA - Connected and Connectionless CTE)
- Support for all Bluetooth 4.2 LE features including LE Secure Connections and Data Length Extension (DLE)
- Integrated BLE Host and Controller supporting System-on-chip (SoC) standalone or network processor dual-device configurations
- Project Zero sample application demonstrates typical peripheral role operations such as controlling LEDs, identifying button states and sending strings of data from a smartphone to the LaunchPad™
- Standalone Peripheral, Broadcaster and Central sample applications to jump start development
- Full integration with TI-RTOS for real-time scheduling, automatic power management and utilizing peripheral device drivers
- Free code development option with Code Composer Studio™ (CCS)
- All example applications now utilize the BLE5-Stack in ROM to maximize application flash memory availability
- Simple_central supports up to 32 concurrent connections
- Secure Boot and Secure Over-the-Air Download (OAD) firmware upgrade support for updating device firmware wirelessly
Additional information about TI’s Bluetooth Low Energy solutions can be found at www.ti.com/ble
BLE5-Stack Documentation
The SimpleLink CC13x2 and CC26x2 Software Development Kit (SDK) allows easier product development by combining TI-RTOS and the BLE protocol stack in one unified SDK. All BLE5-Stack sample applications are based off the TI-RTOS Kernel. Key documents needed for BLE application development include:
Installation and Usage
- To build the sample applications with this SDK a supported a supported IDE must be installed (refer to Dependencies below)
- Install the simplelink_cc13x2_26x2_sdk_5_20_00_xx installer package on a supported host operating system build machine with Administrator privileges
- The default install path for Windows is C:\ti\simplelink_cc13x2_26x2_sdk_5_20_00_xx
- Changing the default install path and/or drive letter may require updating project variables. Do not use a space in the install path
- It is recommended to make a backup of the installation in order to revert modifications to the SDK
What’s New
| ID | Summary |
|---|---|
| BLE_AGAMA-3307 | [MESH] - Add eRPC functionality to IAR examples |
| BLE_AGAMA-3300 | Add new APIs to GAP bond manager to access bonding records |
| BLE_AGAMA-3266 | Removed AoA angle calculation support from RTLS examples |
| BLE_AGAMA-3256 | [MESH] - Update mesh stack to latest (zephyr 2.5.0) |
| BLE_AGAMA-3242 | [704] Add MR & SP OAD Examples to Agama 704 |
| BLE_AGAMA-3232 | Add support for multiple new connections and connection parameter updates to Connection Monitor |
| BLE_AGAMA-3218 | [MESH] Latency & Power Consumption improvements in BLE scheduler |
| BLE_AGAMA-3198 | Support RF command preemption for secondary tasks based on priority |
| BLE_AGAMA-3113 | Modify all RTLS example projects to adhere to the new BT SIG terminology for inclusion |
Fixed Issues
| ID | Summary |
|---|---|
| BLE_AGAMA-3393 | Impersonation the Passkey Entry Protocol – do not except the same x coordinate of the public key during pairing |
| BLE_AGAMA-3384 | DH key check is using local current RPA instead of the RPA used while connection established |
| BLE_AGAMA-3297 | Disconnect from Android devices with HCI error 8C (Inadequate packet length) |
| BLE_AGAMA-3254 | Memory leak while scan disabled in Multi Role application |
| BLE_AGAMA-3214 | Out of the box ble5stack examples fail to sustain a connection with blestack peripherals |
| BLE_AGAMA-3213 | Duplicate Filter - SCAN_PARAM_FLT_DUP is not working as expected |
| BLE_AGAMA-3199 | UTIL_NVWrite always returns Invalid Parameter |
| BLE_AGAMA-3154 | [RTLS] The channels reported by master and passive are different |
| BLE_AGAMA-3135 | GAPBONDMGR osal_snv_write return value is not used |
| BLE_AGAMA-3071 | [RTLS / CM] rtls_passive hop sequence may be wrong |
| BLE_AGAMA-3030 | [SysConfig] Host test SysConfig does not save properly when choosing Custom Board option |
| BLE_AGAMA-2068 | Unsuccessful connection with Motorola Moto G 6 |
Known Issues and Limitations
| ID | Summary |
|---|---|
| SLMAPP-121 | [OAD] The OAD doesn't work for Agama 704k device when working with TI's SimpleLink Starter Mobile Application |
| BLE_AGAMA-3388 | [Mesh] Relay fails to transmit segmented message without re-transmission (relay re-transmit = 0) |
| BLE_AGAMA-3383 | Mesh stack delay work API is limited to a maximum delay of uint32 maximum value (42,949,672 milliseconds) |
| BLE_AGAMA-3381 | Simple Peripheral example application spinlocks while pairing, when compiled with IAR in Debug configuration |
| BLE_AGAMA-3287 | Some example projects hang during pairing with TICLANG due to issue in crypto driver |
| BLE_AGAMA-3258 | [Build] Agama Lite IAR examples fail to build for Debug configuration, due to insufficient RAM |
| BLE_AGAMA-3247 | [MESH] Input OOB doesn't function properly |
| BLE_AGAMA-3193 | [OAD] In all the OAD examples, the OAD doesn't work for BAW/704k device when working with TI's SimpleLink Starter Mobile Application |
| BLE_AGAMA-3169 | Connecting twice to the same device causing wrong count of connections and a memory leakage |
| BLE_AGAMA-3107 | [CLAOA] parsing errors when trying to parse CL_AOA_RESULT_RAW events when using periodic interval smaller than 300ms |
| BLE_AGAMA-3077 | [RTLS] CTE reception on the 2M PHY do not meet spec requirements |
| BLE_AGAMA-3076 | [RTLS] CTEs sent on the 2M PHY do not meet spec requirements |
| BLE_AGAMA-3017 | [MESH] LPN/Friend is disconnecting and reconnecting sporadically while transferring data |
| BLE_AGAMA-2917 | [Build] Persistent Application failed to compile in debug configuration due to memory limitation with all platforms |
| BLE_AGAMA-2845 | [CLAOA] Scanner shows only one IQ report when advertiser sends multiple CTE in one periodic train with 2M PHY |
| BLE_AGAMA-2266 | Central not able to find peer device advertising Extended ADV with aux offset bigger than 16.3ms |
| BLE_AGAMA-2245 | [Simple Peripheral] Number of connections shows zero after a connection if the previous connections were unsuccessful |
| BLE_AGAMA-2033 | [RTLS] Passive Application is not functioning well in Debug configuration. WA: Change the optimization in Debug configuration to High (as in Release) |
| BLE_AGAMA-2010 | [Multi-Sensor] Updating Report Interval Have no effect |
| BLE_AGAMA-1970 | [Multi-Sensor] Some of the Multi Sensor services fail to initiate or open when loading up |
| BLE_AGAMA-1675 | IOP: Device fails to pair with Meizu Pro 7 |
| BLE_AGAMA-1652 | [RTLS] AoA multiple connection: When>4 slaves are connected, the passive node sometimes fails to track some of the connections. |
| BLE_AGAMA-1435 | [Multi-Sensor] Accelerometer Service Disappears After First Connection |
| BLE_AGAMA-1416 | OAD offchip examples needs additional reset to load Factory Image |
| BLE_AGAMA-546 | Central applications do not receive timeout when connection fails |
| BLE_AGAMA-139 | When using multi-role, the random address will display in the serial terminal, instead of the “Work With” selection |
| BLE_AGAMA-80 | The NVS Driver is now used for bond storage. It is not possible to retain OSAL_SNV contents when upgrading from earlier BLE5 1.1.x releases. |
Upgrade and Compatibility Information
The BLE5-Stack 2.02.02.00 only supports SimpleLink CC13x2 and CC26x2 devices with silicon revision E. No support for previous silicon revisions or LaunchPad™ development kits using earlier silicon revisions. If you’re unsure of the revision number of your device, please see the Package Symbolization and Revision Identification section of the Errata Note.
As a supplier of Bluetooth® Low Energy (BLE) solutions with a focus on interoperability and broad market adoption, we recommend to transition from proprietary Real Time Localization Toolbox (RTLS) software examples to the new RTLS software examples based on the Bluetooth 5.1 specification. These examples are included in this software development kit. For further information please contact your local TI sales representative.
Please note that Angle of arrival (AoA) has not yet gone through PHY qualification.
Qualification
The Bluetooth low energy software stack (BLE-Stack) for CC13x2_26x2 BLE-enabled wireless MCUs uses Bluetooth Qualified Components, which allow customers to substantially reduce the testing required to meet Bluetooth end product listing (EPL) qualification requirements while providing flexibility to the device configuration. Bluetooth SIG rules specify that Qualified Components have a validity period of three (3) years at which time they may not be available for new End Product Listings (EPLs). For information on the applicable QDID’s for this release, please refer to the application report SWRA601 - How to Qualify Your Bluetooth Low Energy Product.
Operating System Support
Please refer to the SDK release notes.
Dependencies
The BLE5-Stack sample applications were built & tested with the Integrated Development Environments (IDEs) and listed in the top-level SDK release notes.
Note: Earlier IDE/toolchain versions are not supported and compatibility with newer versions of supported IDEs is not assured.
Device Support
This release supports development of single-mode Bluetooth LE applications on 2.4 GHz and multi-band wireless MCUs listed in the top-level SDK release
Development Board Support
This release supports development of single-mode Bluetooth LE on 2.4 GHz and multi-band wireless MCU development kits listed in the top-level SDK release notes
Validation
The BLE5-Stack sample applications were built & tested with versions of the following Integrated Development Environments (IDEs) and tool chains listed in the top-level SDK release notes:
- Code Composer Studio using the TI C Compiler for Arm
- IAR Embedded Workbench for Arm
Versioning
This product follows a version format, M.mm.pp.bb, where:
- M is a 1 digit major number,
- mm is a 2 digit minor number,
- pp is a 2 digit patch number,
- bb is a 2 digit incrementing build counter.