SimpleLink™ CC13x2_26x2 SDK 5.10.00.48 Release Notes
Table of Contents
Introduction
The SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13x2 and CC26x2 family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13x2 and CC26x2 wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.2, Bluetooth Mesh, Thread 1.1.1 networking stack based on OpenThread, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI’s 15.4 Stack as well as the TI-RTOS kernel and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU through time-division multiplexing.
The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.
This is version 5.10.00.48 of the SimpleLink CC13x2 / CC26x2 SDK.
Documentation
What’s New
- Added support for CC1312R7, CC1352P7, CC2652R7, and CC2652P7.
- The BLE5-Stack has been qualified to Bluetooth Low Energy v5.2. Read more information in the BLE5-Stack release notes.
- The compiler TI Clang is supported by the following components: Core SDK, RF lib, BLE, TI 15.4-Stack, TI Z-Stack, TI OpenThread, DMM, and EasyLink. To use TI Clang the TI Clang plugin is required. See the Upgrade and Compatibility Information section for download links.
- The SysConfig migration tool can be used to migrate from one device to another in the same SDK. Read more about it on the SysConfig migration documentation.
Updated the Core SDK component to version 5.50.02.01. The Core SDK is comprised of the TI-RTOS SYS/BIOS kernel, DriverLib, and TI Drivers.
Refer to the Document Overview for the individual release notes and details for starting development with each SDK component.
Refer to the included Change Log for a summary of new features and fixed issues since the last SDK release.
Upgrade and Compatibility Information
- If you are using GCC and Code Composer Studio, the newest GCC must be downloaded manually. To do this, open the View menu in CCS, and CCS App Center. In the CCS App Center select the ARM GCC compiler for installation.
- TI Arm Clang (tiarmclang) is a new set of compiler tools for TI Arm Cortex-M/R devices and represents the future of the TI Arm compiler. The toolchain is based on the LLVM project, which allows TI to provide a compiler that enables use of open source (GCC-compatible) software frameworks and language standards such as C++14. With tiarmclang TI has leveraged proprietary technology such as our linker to improve code size and minimize runtime support footprint. The tiarmclang toolchain is being provided in a PREVIEW state for customer evaluation. Early documentation is available here.
- Most example projects in the SDK now use SysConfig to configure RF stacks, multi-protocol functionality, CCFG, drivers and peripherals. For more information about SysConfig, see SimpleLink Academy.
- TI Clang users must download TI Clang separately. Please note TI Clang is in short term support, meaning users will be expected to update once a long term support version is released. Download the TI Clang compiler here: https://www.ti.com/tool/ARM-CGT
- If you want to migrate from one device to another within the same SDK, you can use the SysConfig Migration Tool. Learn more about it in the SysConfig migration documentation.
Operating System Support
- Windows® Windows 10
- Ubuntu 18.04 64-bit
- macOS Catalina
Dependencies
SimpleLink CC13x2 / CC26x2 SDK 5.10.00.48 was built & tested on a Windows host platform using the following Integrated Development Environments (IDEs) and components. Using an IDE or toolchain version not listed below may result in compatibility issues with this SDK release. Refer to the individual component release notes in the Document Overview for each component’s supported code generation tools.
- IAR Embedded Workbench: EWARM-8.50.9
- TI Code Composer Studio: CCS-10.3.0
- TI Code Generation Tools for Arm: 20.2.4.LTS
- XDCTools: 3.62.00.08
- SysConfig Standalone tool for IAR IDE: 1.8.0
Device Support
This SDK supports the following SimpleLink CC13x2 and CC26x2 wireless MCUs with silicon revision E:
- CC1312R
- CC1352R
- CC1352P
- CC2642R
- CC2652R
- CC2652RB
- CC2652P
- CC2642R-Q1
- CC2652RSIP
- CC1312R7
- CC1352P7
- CC2652P7
- CC2652R7
Development Board Support
- CC1312R LaunchPad™
- CC1352R LaunchPad™
- CC1352P LaunchPads™
- CC26X2R LaunchPad™
- CC2652RB LaunchPad™
- CC1352R LPSTK
Please see the LaunchPad User Manual for more information on using the individual LaunchPads:
- CC1312R LaunchPad™
- CC1352R LaunchPad™
- CC1352P1 LaunchPad™
- CC1352P-2 LaunchPad™
- CC1352P-4 LaunchPad™
- CC26X2R LaunchPad™
- CC2652RB LaunchPad™
- CC1352R LPSTK
Known Issues
- TI Utils Execution Graph feature is added in SysConfig but it not ready for customer use
- For CC1352P and CC2652P, there is as much as a 3 dB difference in expected vs. actual TX power. For more information see the Hardware Design app note.
- There is an issue when using the IAR CLI tool with SysConfig. If the IAR CLI tool needs to be used, avoid the Clean command.
- For all SDK components, the importing of IAR projects through dev.ti.com is currently not supported
- Refer to the Document Overview for known issues and limitations as published in each SDK component’s release notes
Versioning
This product follows a version format, M.mm.pp.bb, where:
- M is a 1 digit major number,
- mm is a 2 digit minor number,
- pp is a 2 digit patch number,
- bb is a 2 digit incrementing build counter.