TI BLE5-Stack 2.01.00.00 Release Notes
Table of Contents
- Introduction
- BLE5-Stack Documentation
- Installation and Usage
- What’s New
- Fixed Issues
- Known Issues and Limitations
- Upgrade and Compatibility Information
- Qualification
- Operating System Support
- Dependencies
- Device Support
- Development Board Support
- Validation
- Versioning
- Technical Support and Product Updates
Introduction
The BLE5-Stack is a set of sample applications, tools, APIs and protocol stack libraries that enable engineers to develop Bluetooth ® 5 standalone or network processor LE applications on the SimpleLink™ CC13x2 and CC26x2 family of wireless MCUs. This Bluetooth 5 (BLE5-Stack) release includes support to enable development of applications using the following Bluetooth 5 LE features: High Speed, Long Range (LE Coded PHYs), Advertisement Extensions as well as all existing Bluetooth 4.0, 4.1 and 4.2 LE features.
As with all Bluetooth core specifications that support the Low Energy (LE) feature, devices implementing the LE feature of Bluetooth 5 are backward compatible with Bluetooth 4.2, 4.1 and 4.0 LE capable devices.
BLE5-Stack 2.01.00.00 has been Bluetooth 5 qualified and is available for production use.
Key features of BLE5-Stack 2.01.00.00 :
- Real-Time Localization System (RTLS) support added including Bluetooth 5.1 Direction Finding (AoA), and Time of Flight which allows for protection against relay attacks
- Initial Bluetooth 5.1 qualified release for production
- Supports the following Bluetooth 5 LE features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and 500 kbps PHYs), Advertisement Extensions (AE) non-periodic, Privacy 1.2.1 and Channel Selection Algorithm #2
- Support for all Bluetooth 4.2 LE features including LE Secure Connections and Data Length Extension (DLE)
- Integrated BLE Host and Controller supporting System-on-chip (SoC) standalone or network processor dual-device configurations
- Project Zero sample application demonstrates typical peripheral role operations such as controlling LEDs, identifying button states and sending strings of data from a smartphone to the LaunchPad™
- Standalone Peripheral, Broadcaster and Central sample applications to jump start development
- Full integration with TI-RTOS for real-time scheduling, automatic power management and utilizing peripheral device drivers
- Secure Over-the-Air Download (OAD) firmware upgrade support for updating device firmware wirelessly
- Free code development option with Code Composer Studio™ (CCS)
- All example applications now utilize the BLE5-Stack in ROM to maximize application flash memory availability
- Simple_central supports up to 32 concurrent connections
- Secure Boot and Secure Over-the-Air Download (OAD) firmware upgrade support for updating device firmware wirelessly
Additional information about TI’s Bluetooth Low Energy solutions can be found at www.ti.com/ble
BLE5-Stack Documentation
The SimpleLink CC13x2 and CC26x2 Software Development Kit(SDK) allows easier product development by combining TI-RTOS and the BLE protocol stack in one unified SDK. All BLE5-Stack sample applications are based off the TI-RTOS Kernel. Key documents needed for BLE application development include:
Installation and Usage
- To build the sample applications with this SDK a supported a supported IDE must be installed (refer to Dependencies below)
- Install the simplelink_cc13x2_26x2_sdk_3_30_00_xx installer package on a supported host operating system build machine with Administrator privileges
- The default install path for Windows is C:\ti\simplelink_cc13x2_26x2_sdk_3_30_00_xx and is referenced as $BLE_INSTALL$ in the documentation
- Changing the default install path and/or drive letter may require updating project variables. Do not use a space in the install path
- It is recommended to make a backup of the installation in order to revert modifications to the SDK
What’s New
ID | Summary |
---|---|
BLE_AGAMA-1219 | [RTLS] ToF security shall use TI DRIVERS DRBG |
BLE_AGAMA-1209 | Migrate to use multi-page NV interface |
BLE_AGAMA-1207 | [RTLS] Save ToF calibration to the NV |
BLE_AGAMA-1206 | [RTLS] Added user configurable Link Quality Indication (LQI) and magnitude difference filter for ToF |
BLE_AGAMA-1205 | [RTLS] Implemented Time of Flight role switching feature |
BLE_AGAMA-1194 | [RTLS] Added RTLSCtrl API to dynamically alter connection parameters |
BLE_AGAMA-1167 | Added feature where central device will schedule anchor points for new connections with 5ms spacing |
BLE_AGAMA-1166 | Added feature where non connectable and non scannable advertisement sets can use different BLE addresses |
BLE_AGAMA-1118 | Added a feature where Max TX power can be set per channel on CC1352P-2 devices |
BLE_AGAMA-1064 | Added support for BLE5.1 Errata 10336 related to privacy: Potential compatibility break for devices forming connections over the Auxiliary Advertising channels or using directed advertising. Refer to documentation for more information. |
BLE_AGAMA-558 | Added support for Out of Band Paring (OOB) in GapBondMgr |
Fixed Issues
ID | Summary |
---|---|
BLE_AGAMA-1367 | Stack may not schedule advertisements when more than one device is connected |
BLE_AGAMA-1300 | Fixed issue where HCI_EXT_getActiveConnInfoCmd returns invalid CRC_INIT |
BLE_AGAMA-1217 | RTLS Passive sync issues: missing the first word will stop Passive ToF in Dynamic Sync-word mode |
BLE_AGAMA-1180 | Fix issue with data alignment of RF buffers on connection monitor |
BLE_AGAMA-1130 | Fixed an issue where setting the parameter SCAN_PARAM_FLT_POLICY can cause device to hang |
BLE_AGAMA-1126 | Fixed an issue where TOF measurements at long distances would be inaccurate |
BLE_AGAMA-1101 | Incoming Slave Security Request not handled properly by the GapBondMgr and will trigger a new pair |
BLE_AGAMA-1090 | When previously bonded, upon re-connection, slave should send a slave security request |
BLE_AGAMA-1062 | [RTLS] rtls_passive won't re-sync when using TOF_MODE_AUTO run mode |
BLE_AGAMA-906 | Fixed issue where legacy advertisement set data length was not validated |
BLE_AGAMA-754 | Added sanity checks to GapAdv_loadByHandle for scannable properties |
BLE_AGAMA-722 | Optimized time to first advertisement |
BLE_AGAMA-624 | Fixed issue where linkDb is updated even when connection parameter update fails |
BLE_AGAMA-460 | Fixed issue where using auto-sized heap would prevent use of ROV |
Known Issues and Limitations
ID | Summary |
---|---|
BLETOOLS-213 | AE and legacy advertising sets number is limited to 20 |
BLESTACK-3843 | RTOS logging of certain high-priority events, such as SWIs and HWIs, may interfere with reception of a scan response chain |
BLE_AGAMA-1458 | CC1352-P2 fails to enable legacy advertise command when channel 37 is not included in the channel map |
BLE_AGAMA-1445 | Example failed to load when configured to non-default power level in the advertisement sets |
BLE_AGAMA-1441 | [RTLS Passive] AoA angle calculation is deviated in small angles (0-10 degrees) |
BLE_AGAMA-1437 | [RTLS] Angle performance is not stable when antenna array 2 is used |
BLE_AGAMA-1435 | [Multi-Sensor] Accelerometer Service Disappears After First Connection |
BLE_AGAMA-1432 | [RTLS] Configuration of slot_duration=1 is not supported in AoA |
BLE_AGAMA-1416 | OAD offchip examples needs additional reset to load Factory Image |
BLE_AGAMA-1411 | [TOF] ToF Master/Slave may go out of sync when RSSI is below -60 |
BLE_AGAMA-1370 | CC13x2-P2 persistent app failed to compile in debug configuration |
BLE_AGAMA-1116 | [RTLS] TOF is not stable for connection interval greater than 1 second |
BLE_AGAMA-546 | Central applications do not receive timeout when connection fails |
BLE_AGAMA-139 | When using multi-role, the random address will display in the serial terminal, instead of the “Work With” selection |
BLE_AGAMA-80 | The NVS Driver is now used for bond storage. It is not possible to retain OSAL_SNV contents when upgrading from earlier BLE5 1.1.x releases. |
Upgrade and Compatibility Information
The BLE5-Stack 2.01.00.00 only supports SimpleLink CC13x2 and CC26x2 devices with silicon revision E. No support for previous silicon revisions or LaunchPad™ development kits using earlier silicon revisions. If you’re unsure of the revision number of your device, please see the Package Symbolization and Revision Identification section of the Errata Note.
Qualification
The Bluetooth low energy software stack (BLE-Stack) for CC13x2_26x2 BLE enabled wireless MCUs uses Bluetooth Qualified Components, which allow customers to substantially reduce the testing required to meet Bluetooth end product listing (EPL) qualification requirements while providing flexibility to the device configuration. Bluetooth SIG rules specify that Qualified Components have a validity period of three (3) years at which time they may not be available for new End Product Listings (EPLs). This SDK release is covered by QDID 135969 with expiration date 2022-09-19 and TCRL 2018-2. For more information please refer to the application report SWRA601 - How to Qualify Your Bluetooth Low Energy Product.
Operating System Support
- Microsoft Windows® 7 SP1, Windows 8.1 or Windows 10
- Ubuntu 14.04 64-bit, Ubuntu 16.04 64-bit
- macOS Sierra
Dependencies
The BLE5-Stack sample applications were built & tested with the Integrated Development Environments (IDEs) and listed in the top-level SDK release notes.
Note: Earlier IDE/toolchain versions are not supported and compatibility with newer versions of supported IDEs is not assured.
Device Support
This release supports development of single-mode Bluetooth LE applications on 2.4 GHz and multi-band wireless MCUs listed in the top-level SDK release
Development Board Support
This release supports development of single-mode Bluetooth LE on 2.4 GHz and multi-band wireless MCU development kits listed in the top-level SDK release notes
Validation
The BLE5-Stack sample applications were built & tested with versions of the following Integrated Development Environments (IDEs) and tool chains listed in the top-level SDK release notes:
- Code Composer Studio using the TI C Compiler for Arm
- IAR Embedded Workbench for Arm
Versioning
This product follows a version format, M.mm.pp.bb, where:
- M is a 1 digit major number,
- mm is a 2 digit minor number,
- pp is a 2 digit patch number,
- bb is a 2 digit incrementing build counter.