This section helps in migrating the SDK Software from 6432 ES1.0 to 6432 ES2.0 devices.

Build file updates

• Make files have to be updated to use "mmwave_rfs_patch_rprc.bin" instead of "mmwave_rfs_rprc.bin" for Front End (FECSS) Firmware.
• Linker file have to be updated for increasing "HWASS_SHM_MEM" section length to 512KB for accounting 96KB FECSS/HWASS Shared Memory.
• Examples which use "fecss_rom_m4.lib" should start linking "fecss_patch_m4.lib" as well in the Make files.

OOB Demo/ Example updates

• Use firmware package with version 3.1.7.0 or later.
• As some part of FESS firmware is going to run from ROM memory, new MPU entry has to be added to make the ROM area allow code execution in-addition to Supervisor/User Read and Write access. Refer to OOB Demo SysCfg for reference.
• In OOB Demos, FECSS memory retention during LPDS state has to be updated from "PRCM_FEC_PD_SRAM_CLUSTER_2 and PRCM_FEC_PD_SRAM_CLUSTER_3" to "PRCM_FEC_PD_SRAM_CLUSTER_1".
• Remove the code that disables BGAP hibernation during LPDS in Power driver as this issue is fixed now.
• Remove the initialization code that disables Slicer LDO TLOAD as this is being done by RBL.