3.1.1.2. Build
3.1.1.2.1. Build U-Boot
Note
The following commands are intended to be run from the root of the U-Boot tree unless otherwise specified. The root of the U-Boot tree is the top-level directory and can be identified by looking for the “MAINTAINERS” file.
Note
As of Processor SDK 9.0, compilation of bootloader images will no longer require different defconfigs for GP and HS devices. The same build commands will generate images for GP, HS-SE and HS-FS devices.
Prebuilt Images
Several prebuilt images are required from the TI Processor SDK for building U-Boot on K3 based platforms.
TF-A (BL-31): Refer to ARM Trusted Firmware-A for more information
OP-TEE (TEE): Refer to OP-TEE for more information
ti-linux-firmware (BINMAN_INDIRS): Prebuilt binaries for DM and SYSFW available here.
All of these binaries are available in the SDK at <path to tisdk>/board-support/prebuilt-images>
Compiling R5 and ARM64 images
Use the following table to determine what defconfig to use to configure with:
Board |
SD / UART / OSPI Boot |
eMMC Boot |
|---|---|---|
AM64X EVM |
|
|
AM64X SK |
|
Note
Where to get the sources: Getting the Source Code
$ export UBOOT_DIR=<path-to-ti-u-boot>
$ export TI_LINUX_FW_DIR=<path-to-ti-linux-firmware>
$ export TFA_DIR=<path-to-arm-trusted-firmware>
$ export OPTEE_DIR=<path-to-ti-optee-os>
Note
The instructions below assume all binaries are built manually. For instructions to build bl31.bin go to: OP-TEE.
For instructions to build tee-pager_v2.bin (bl32.bin) go to: ARM Trusted Firmware-A. BINMAN_INDIRS can point to
<path-to-tisdk>/board-support/prebuilt-images/am64xx-evm to use the pre-built binaries that come in the pre-built SDK (bl31.bin for BL31, bl32.bin for TEE).
$ cd $UBOOT_DIR
R5
To build tiboot3.bin. Saved in $UBOOT_DIR/out/r5.
$ make ARCH=arm CROSS_COMPILE="$CROSS_COMPILE_32" am64x_evm_r5_defconfig O=$UBOOT_DIR/out/r5
$ make ARCH=arm CROSS_COMPILE="$CROSS_COMPILE_32" O=$UBOOT_DIR/out/r5 BINMAN_INDIRS=$TI_LINUX_FW_DIR
A53
To build tispl.bin and u-boot.img. Saved in $UBOOT_DIR/out/a53.
$ make ARCH=arm CROSS_COMPILE="$CROSS_COMPILE_64" am64x_evm_a53_defconfig O=$UBOOT_DIR/out/a53 BINMAN_INDIRS=$TI_LINUX_FW_DIR
$ make ARCH=arm CROSS_COMPILE="$CROSS_COMPILE_64" CC="$CC_64" BL31=$TFA_DIR/build/k3/lite/release/bl31.bin TEE=$OPTEE_DIR/out/arm-plat-k3/core/bl32.bin O=$UBOOT_DIR/out/a53 BINMAN_INDIRS=$TI_LINUX_FW_DIR
Note
BINMAN_INDIRS is used to fetch the DM binary from <path to ti-linux-firmware>/ti-dm/ and SYSFW binaries from <path to ti-linux-firmware>/ti-sysfw/. If using the SDK, BINMAN_INDIRS can point to <path to SDK>/board-support/prebuilt-images. Else any folder where DM is located in <path to folder>/ti-dm/ and SYSFW binaries are present in <path to folder>/ti-sysfw/ can be used. Please make sure to use the absolute path.