2.1. Release Notes

2.1.1. Overview

The Processor Software Development Kit (Processor SDK) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos. All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly reuse and develop software across devices. Developing a scalable platform solutions has never been easier than with the Processor SDK and TI’s embedded processor solutions.

To simplify the user experience, Processor SDK Linux AM62L installer provides everything needed as discussed below to create the embedded system from “scratch” :

  • Platform/board-support software and configuration files for Linux

  • U-Boot and Kernel sources and configuration files

  • An ARM cross-compiling toolchain as well as other host binaries and components

  • A Yocto/OE compliant filesystem and sources for example applications

  • A variety of scripts and Makefiles to automate certain tasks

  • Other components needed to build an embedded system that don’t fit neatly into one of the above buckets

  • Reference Examples, benchmarks

This release supports High Security - Field Securable (HS-FS) devices.

2.1.2. Release versioning scheme

Processor SDK releases follow the 5-duplet versioning scheme YY.RR.EE.CC.SS, where:

  • YY - Yearly baseline. Increments with each new LTS baseline.

  • RR - Release index within the yearly baseline. Each yearly baseline includes many stable releases.

  • EE - Extended release index within a stable baseline.

  • CC - Release Candidate for common foundational BSP components such as Linux, U-Boot, ATF, OPTEE, Firmware and OE manifest including meta-ti, meta-arago.

  • SS - SDK Release identifier for Distro layers (Yocto meta-tisdk, Armbian, Buildroot) with OOB Demos and Installers.

2.1.3. Licensing

Please refer to the software manifests, which outlines the licensing status for all packages included in this release. The manifest can be found on the SDK download page or in the installed directory as indicated below.

2.1.4. Software Bill of Materials (SBOM)

AM62L-Linux-SDK releases include Software Bill of Materials (SBOM) files in SPDX 3.0 format for Yocto and CycloneDX 1.6 format for Buildroot. SBOMs for all released artifacts are bundled into a single archive and can be found on the AM62L-SDK-Download-page. For more refer Working with SBOM.

2.1.5. Release 12.00.00.07.04

Released on Apr 2026

2.1.5.1. What’s new

Processor SDK Linux AM62LX Release has following new features:

  • First 2026 LTS Reference Release Including RT combined branch model

  • Uboot: A53 SPL Falcon boot

  • Important Bug Fixes on top of Processor SDK 11.02.08.02 Release.

  • Review Issue Tracker Section for the new fixes.

  • Support for multiple Linux distributions, such as Yocto, Debian and Buildroot

  • OPTEE: Hardware-backed secure key storage via RPMB with PKCS#11 interface

  • Security: ATF, OPTEE and RNG memory firewall for isolation from Linux

  • Security: Yocto reference for LUKS2 root filesystem encryption with fTPM key management

  • Secure boot: Support for U-boot FIT image signing and verification

Key Release References:

Component version:

  • Kernel (Including RT) 6.18.13

  • U-Boot 2026.01

  • Toolchain GCC 15.2

  • OPTEE 4.9.0+

  • ATF 2.14+

  • TIFS Firmware v12.00.02 (Click on the link for more information)

  • Yocto Master

  • Armbian-based Debian 13 (Trixie)

  • Buildroot 2026.02

2.1.6. Build Information

2.1.6.1. Arago (Yocto/OE)

Component

Branch Info

Tag Info

Config Info

U-Boot

ti-u-boot-2026.01

12.00.00.07

Build Config

TF-A

ti-tfa-2.14.y

v2.14+

OPTEE

master

4.9.0+

k3-am62lx

Linux Firmware

ti-linux-firmware

12.00.00.07

Linux Kernel

ti-linux-6.18.y

12.00.00.07

non-RT , RT

meta-ti

master

12.00.00.07

am62lxx-evm

meta-arago

master

12.00.00.07

meta-tisdk

master

12.00.00.07.04

2.1.6.2. Debian (Armbian)

Component

Branch Info

Tag Info

Config Info

U-Boot

ti-u-boot-2026.01

12.00.00.07

Build

TF-A

ti-tfa-2.14.y

v2.14+

Build

OPTEE

master

4.9.0+

Build

Linux Firmware

ti-linux-firmware

12.00.00.07

Git Clone

Linux Kernel

ti-linux-6.18.y

12.00.00.07

non-RT, RT

Armbian Build

2026.04-release

12.00.00.07.04

Board: TMDS62LEVM

2.1.6.3. Buildroot (Buildroot External TI)

Component

Branch Info

Tag Info

Config Info

U-Boot

ti-u-boot-2026.01

12.00.00.07

Build

ATF

ti-tfa-2.14.y

v2.14+

Build

OPTEE

master

4.9.0+

Build

Linux Firmware

ti-linux-firmware

12.00.00.07

Git Clone

Linux Kernel

ti-linux-6.18.y

12.00.00.07

non-RT, RT

Buildroot External TI

main

12.00.00.07.04

Build, Board

Buildroot

2026.02.x

2026.02

2.1.7. Issues Tracker

Note

  • Release Specific Issues including details will be published through Software Incident Report (SIR) portal

  • Further Information can be found at SIR Portal

2.1.7.1. Errata Open

Record ID

Title

EXT_EP-13304

U-Boot: MMCSD HS200 Write Failures

2.1.7.2. Errata Closed

Record ID

Title

EXT_EP-13303

Kernel: MMCSD HS200 Write Failures

2.1.7.3. Issues Resolved

Record ID

Title

EXT_EP-13314

AM62Lx Linux SDK documentation on CPSW XDP points to PRU-ICSSG XDP

EXT_EP-13315

U-Boot: Enable caches for A53 SPL AM62l

EXT_EP-13145

AM62L: Network stability issues

EXT_EP-12979

AM62L: Suspend-Resume (RTC+DDR): davinci_mdio timed out waiting for user access

2.1.7.4. Issues Open

Record ID

Title

EXT_EP-13319

[AM62L OSPI NOR] Fix OSPI NOR Flash random corruption in IO

EXT_EP-12980

AM62L: Random kernel crash observed on stress test

EXT_EP-13124

AM62L two stage BL booting from redundant GPMC-NAND partition