AM263x INDUSTRIAL COMMUNICATIONS SDK  09.01.00
Release Notes 09.01.00

Attention
Also refer to individual module pages for more details on each feature, unsupported features, important usage guidelines.
For release notes of MCU+ SDK, please refer to AM263X MCU+ SDK Release Notes 09.01.00.
Note
The examples will show usage of SW modules and APIs on a specific CPU instance and OS combination.
Unless noted otherwise, the SW modules would work on all supported EVMs

New in this Release

Feature
Bug Fixes

Device and Validation Information

SOC Supported CPUs Boards Host PC
AM263x R5F AM263x GP CC (referred to as am263x-cc in code),
AM263x LAUNCHPAD (referred to as am263x-lp in code)
Windows 10 64b or Ubuntu 18.04 64b

Tools, Compiler and Other Open Source SW Module Information

Tools / SW module Version
Code Composer Studio 12.5.0
SysConfig 1.18.0, build 3266
TI ARM CLANG 3.2.0.LTS
MCU+ SDK 9.1.0
Attention
TI ARM CLANG 3.2.0.LTS is not part of CCS by default, Follow steps at TI CLANG Compiler Toolchain to install the compiler.

Key Features

Fixed Issues

ID Head Line Module Applicable Releases Resolution/Comments
PINDSW-7084 DP83826E PHY configuration mismatch for Odd Nibble Detection EtherCAT Device 09.00.00 -
PINDSW-7095 Incorrect RAM size configuration for AM263x Devices EtherCAT Device 09.00.00 -

Known Issues

ID Head Line Module Applicable Releases Workaround
- - - - -

Upgrade and Compatibility Information

This section lists changes which could affect user applications developed using older SDK versions. Read this carefully to see if you need to do any changes in your existing application when migrating to this SDK version relative to previous SDK version. Also refer to older SDK version release notes to see changes in earlier SDKs.

Examples

Module Affected API Change Additional Remarks

Drivers

Module Affected API Change Additional Remarks