Table of Contents

Early Samples Migration Guide

Introduction

IMPORTANT: This guide is only applicable to customer who received early samples of MSPM0 and will migrate their existing application to production samples.

The purpose of this document is to highlight:

• Compatibility breaks between MSPM0 SDK version supporting early samples and MSPM0 SDK 1.00.00.xx which supports production samples.
• Considerations when developing on early samples and production samples in the same system.

Customers using early samples are highly encouraged to migrate their applications to a MSPM0 SDK version supporting production samples. MSPM0 SDK support for experimental samples will not be supported long-term.

The section below describes the recommended tool versions which support production samples and provides migration guidelines for applications using DriverLib and SysConfig configuration files.

The guide assumes users are working in a Windows environment. However, the concepts discussed in this guide are also applicable to Linux and MacOS.

Which samples are supported by my current MSPM0 SDK?

• If your MSPM0 SDK has a *_eng* suffix in the version number, the SDK supports early samples.
• If your MSPM0 SDK does not have a *_eng* suffix in the version number, the SDK supports production samples.

How to determine MSPM0 sample versions

You have production samples if:

• You were able to order samples directly from ti.com and didn’t need to contact a TI sales office.

You have early samples if:

• You did not order samples directly from ti.com and to order samples through a TI sales office.

Customers can also determine sample version by reading the VERSION bit fields (31-28) in the DEVICEID Register which is part of Device Factory Constant memory region (Located in address 0x41C40000). If VERSION bit fields is:

• 0x0, then is an early sample device
• 0x1, then is a production sample device

Important Documents

• MSPM0L130x, MSPM0L134x, MSPM0L110x specific
  • MSPM0G and MSPM0L Families: Functional Differences With Early Samples. Please request your TI sales office access to this document.
  • MSPM0Lx Technical Reference Manual
  • MSPM0L134x, MSPM0L130x datasheet
  • MSPM0L110x datasheet
• MSPM0G350x,MSPM0G310x,MSPM0G150x,MSPM0G110x, specific
  • MSPM0G and MSPM0L Families: Functional Differences With Early Samples. Please request your TI sales office access to this document.
  • MSPM0Gx Technical Reference Manual
  • MSPM0G350x datasheet
  • MSPM0G310x datasheet
  • MSPM0G150x datasheet
  • MSPM0G110x datasheet

Tools Considerations

The table below lists the MSPM0 production compatible versions for use with production sample

Product	Version
MSPM0 SDK	1.00 or later
SysConfig	1.15.0_2826 or later
CCS Eclipse	12.2.0 or later
CCS Theia	1.0 or later
IAR Embedded workbench for ARM	9.32.1 or later
Keil MDK-Arm with uVision	5.38a or later

Code Composer Studio (CCS)

The following Code Composer Studio versions support production samples for MSPM0 devices:

• Code Composer Studio 12.2.0 or later
• Code Composer Studio Theia 1.0 or later

IMPORTANT: For customers planning to work with early samples and production samples, it is highly recommended to have dedicated CCS installation under a different install path than the default installation path. For example, the CCS installation for production samples can be C:\ti\production.

IAR Embedded workbench for ARM

IAR Embedded workbench for ARM 9.32 or later supports production samples for MSPM0 devices.

IMPORTANT: For customers planning to work with early samples and production samples, it is highly recommended to have dedicated IAR installation under a different install path than the default installation path. For example, the IAR installation for production samples can be C:\Program Files\IAR Systems\production. For instructions to select a SysConfig in IAR please refer to Enabling SysConfig in IAR in the SysConfig guide.

Keil MDK-Arm with uVision

For production sample development, Keil MDK-Arm with uVision v5.38a or later, with ARM Clang compiler v6.16 or later is still recommended and users are required to install the latest TexasInstruments.MSPM0L_DFP pack or TexasInstruments.MSPM0G_DFP pack as described in MSPM0 SDK KEIL Quick Start Guide

IMPORTANT: For customers planning to work with early samples and production samples, it is highly recommended to have dedicated Keil installation under a different install path than the default installation path. For example, the Keil installation for production samples can be C:\Keil_v5\production. For instructions to select a SysConfig version in Keil please refer to Enabling SysConfig in Keil in the SysConfig guide.

DriverLib Changes

This sections summarized the APIs, defines, and enums which have been updated or removed in Driverlib. Customers can reference this section to determine the appropriate action needed to resolve compilation errors during the migration.

Each subsection name below makes reference to the header and/or source file name which are located under <MSP_SDK_REPO_INSTALL_DIR>\source\ti\driverlib or <MSP_SDK_REPO_INSTALL_DIR>\source\ti\driverlib\m0p\sysctl\mspm0g.

The following scheme has been used to in the Driverlib sections:

• Text in red indicates the early sample Driverlib API/Enum/Define that is no longer available in MSPM0 SDK 1.00.00.xx
• Bold text is used to identify a renamed or new input argument in an API in MSPM0 SDK 1.00.00.xx

dl_sysctl_mspm0g

Defines

Define Group	Removed	Added	Update related to
DL_SYSCTL_INTERRUPT	DL_SYSCTL_INTERRUPT_BOR_LEVEL	DL_SYSCTL_INTERRUPT_SRAM_SEC	PMCU_ENH_02
	DL_SYSCTL_INTERRUPT_FLASH_DED
	DL_SYSCTL_INTERRUPT_LFCLK_FAIL

Enums

Enum Name	Removed	Added	Update related to
DL_SYSCTL_IIDX	DL_SYSCTL_IIDX_BOR_LEVEL	DL_SYSCTL_IIDX_SRAM_SEC	PMCU_ENH_02
	DL_SYSCTL_IIDX_FLASH_DED
	DL_SYSCTL_IIDX_LFCLK_FAIL

APIs

Removed

• DL_SYSCTL_setSRAMWriteProtection
  • Please refer to the following new API:
    • DL_SYSCTL_setSRAMBoundaryAddress
• DL_SYSCTL_getSRAMWriteProtection
  • Please refer to the following new API:
    • DL_SYSCTL_getSRAMBoundaryAddress
• DL_SYSCTL_useLowerFlashBank
  • Current MSPM0G production sample devices don’t support multiple flash banks.
• DL_SYSCTL_useUpperFlashBank
  • Current MSPM0G production sample devices don’t support multiple flash banks.
• DL_SYSCTL_setUpperFlashBank
  • Current MSPM0G production sample devices don’t support multiple flash banks.

Updated

• DL_SYSCTL_setLFCLKSourceEXLF
  • API prototype changed from DL_SYSCTL_setLFCLKSourceEXLF(bool enableMonitor) to DL_SYSCTL_setLFCLKSourceEXLF(void)

dl_sysctl_mspm0l

Defines

Define Group	Removed	Added	Update related to
DL_SYSCTL_INTERRUPT	DL_SYSCTL_INTERRUPT_BOR_LEVEL		PMCU_ENH_02

NOTE: This interrupt is the only “Power Interrupt” for the M0L, so the entire section has been removed. You can no longer powerSysInterrupts or pmcuInterruptPriority for the MSPM0L device

Enums

Enum Name	Removed	Added	Update related to
DL_SYSCTL_IIDX	DL_SYSCTL_IIDX_BOR_LEVEL		PMCU_ENH_02

APIs

Removed

• DL_SYSCTL_setSRAMWriteProtection
  • Please refer to the following new API:
    • DL_SYSCTL_setSRAMBoundaryAddress
• DL_SYSCTL_getSRAMWriteProtection
  • Please refer to the following new API:
    • DL_SYSCTL_getSRAMBoundaryAddress
• DL_SYSCTL_useLowerFlashBank
  • Current MSPM0L production sample devices don’t support multiple flash banks.

dl_crc

Enums

• Enum DL_CRC_ENDIANESS was renamed to DL_CRC_INPUT_ENDIANESS due to CRC_ENH_01

APIs

Removed

• DL_CRC_saveConfiguration
  • Removed due to early sample device bug fix CRC_01
• DL_CRC_restoreConfiguration
  • Removed due to early sample device bug fix CRC_01

Updated

• DL_CRC_init
  • Updated API to support “output byte swap” configuration
    • Production version of the SDK API has new input parameter DL_CRC_init(CRC_Regs *crc, DL_CRC_POLYNOMIAL poly, DL_CRC_BIT bitOrd, DL_CRC_INPUT_ENDIANESS inEndianness, DL_CRC_OUTPUT_BYTESWAP outByteSwap)

dl_dma

Enums

Enum name	From	To	Update related to
DL_DMA_TRANSFER_MODE	DL_DMA_REPEAT_SINGLE_TRANSFER_MODE	DL_DMA_FULL_CH_REPEAT_SINGLE_TRANSFER_MODE	DMA_ENH_01 and DMA_ENH_02
	DL_DMA_REPEAT_BLOCK_TRANSFER_MODE	DL_DMA_FULL_CH_REPEAT_BLOCK_TRANSFER_MODE
DL_DMA_EXTENDED_MODE	DL_DMA_FILL_MODE	DL_DMA_FULL_CH_FILL_MODE
	DL_DMA_TABLE_MODE	DL_DMA_FULL_CH_TABLE_MODE

Struct

The following struct members were added:

Struct name	Added	Update related to
DL_DMA_Config	DL_DMA_TRIGGER_TYPE triggerType	Configure whether the DMA selects an internal or external channel as the DMA trigger. DMA_ENH_06

APIs

Updated

• DL_DMA_setTrigger
  • Updated API to support simple cascading of DMA channels configuration (DMA_ENH_06).
    • Production version of the SDK API has new input parameter DL_DMA_setTrigger(DMA_Regs *dma, uint8_t channelNum, uint8_t trigger, DL_DMA_TRIGGER_TYPE triggerType)

dl_i2c

Enums

Enum Name	Removed	Added	Update related to
DL_I2C_IIDX	DL_I2C_IIDX_CONTROLLER_CLOCK_TIMEOUT	DL_I2C_IIDX_TIMEOUT_A	I2C_ENH_05
		DL_I2C_IIDX_TIMEOUT_B

Defines

Define Group	Removed	Added	Update related to
DL_I2C_INTERRUPT	DL_I2C_INTERRUPT_CONTROLLER_CLOCK_TIMEOUT	DL_I2C_INTERRUPT_TIMEOUT_A	I2C_ENH_05
		DL_I2C_INTERRUPT_TIMEOUT_B

APIs

Removed

• DL_I2C_getClockLowTimeoutCounterPreload
  • Please refer to the following new APIs:
    • DL_I2C_getTimeoutACount
    • DL_I2C_getTimeoutBCount
• DL_I2C_setClockLowTimeoutCounterPreload
  • Please refer to the following new APIs:
    • DL_I2C_setTimeoutACount
    • DL_I2C_setTimeoutBCount
• DL_I2C_getClockLowTimeoutCounter
  • Please refer to the following new API:
    • DL_I2C_getCurrentTimeoutACounter
    • DL_I2C_getCurrentTimeoutBCounter

dl_mathacl

Enum Name	Removed	Recommendation
DL_MATHACL_OP_TYPE	DL_MATHACL_OP_TYPE_ARCTAN	Use DL_MATHACL_OP_TYPE_ARCTAN2
	DL_MATHACL_OP_TYPE_MPY	Use DL_MATHACL_OP_TYPE_MPY32

dl_opa

APIs

Removed

• DL_OPA_isSoftwareBusy
  • Bit field BUSY was removed from OPA.STAT register

dl_rtc

APIs

Updated

• DL_RTC_setTemperatureCompensation
  • Function prototype changed from DL_RTC_setTemperatureCompensation(RTC_Regs *rtc, DL_RTC_TEMP_CALIBRATION offsetDirection, uint32_t offsetValue) to void DL_RTC_setTemperatureCompensation(RTC_Regs *rtc, DL_RTC_TEMP_CALIBRATION_SIGN offsetDirection, uint32_t offsetValue)
    • DL_RTC_TEMP_CALIBRATION_SIGN_DOWN was renamed to DL_RTC_TEMP_CALIBRATION_DOWN1PPM
    • DL_RTC_TEMP_CALIBRATION_SIGN_UP was renamed to DL_RTC_TEMP_CALIBRATION_UP1PPM

dl_spi

Struct

The following struct members were added:

Struct name	Added	Purpose
DL_SPI_Config	DL_SPI_DATA_SIZE dataSize	Specify the size of the data transfer
	DL_SPI_CHIP_SELECT chipSelectPin	Specify the pin to use for chip select. Used in Controller or Peripheral modes with Motorola formats.

Enums

Enum Name	Removed	Added	Update related to
DL_SPI_PARITY	DL_SPI_PARITY_BIT0_EVEN	DL_SPI_PARITY_EVEN
	DL_SPI_PARITY_BIT0_ODD	DL_SPI_PARITY_ODD
	DL_SPI_PARITY_BIT1_EVEN
	DL_SPI_PARITY_BIT1_ODD

APIs

Removed

• DL_SPI_setControllerChipSelect
  • Please refer to the following new API:
    • DL_SPI_setChipSelect
• DL_SPI_getControllerChipSelect
  • Please refer to the following new API:
    • DL_SPI_getChipSelect

Updated

• DL_SPI_setDataSize
  • Function prototype changed from DL_SPI_setDataSize(SPI_Regs *spi, uint32_t dataSize) to DL_SPI_setDataSize( SPI_Regs *spi, DL_SPI_DATA_SIZE dataSize)
• DL_SPI_getDataSize
  • Function prototype changed from uint32_t DL_SPI_getDataSize(SPI_Regs *spi) to DL_SPI_DATA_SIZE DL_SPI_getDataSize(SPI_Regs *spi)

dl_timera

APIs

Removed

• DL_TimerA_configPipelineUpdate
  • Please refer to the following new API:
    • DL_TimerA_setCaptCompUpdateMethod
• DL_TimerA_getPipelineUpdateMode
  • Please refer to the following new API:
    • DL_TimerA_getCaptCompUpdateMethod
• DL_TimerA_setCaptureCompareValuePipeline
  • PCC register has been removed in production sample. Capture compare update mode is now configured via DL_TimerA_setCaptCompUpdateMethod and DL_TimerA_setLoadValue

dl_timerg

Defines

Updated

• DL_TIMERG_INTERRUPT_DIR_CHANGE_EVENT renamed to DL_TIMERG_INTERRUPT_DC_EVENT

APIs

Updated

• DL_Timer_setCaptureCompareAction
  • actionsMask argument no longer accepts DL_TIMER_CC_DBEXACT or DL_TIMER_CC_DBENACT masks since DBEXACT and DBENACT bitfields in CCACT_01 register have been removed.

Removed

• DL_TimerG_configPipelineUpdate
  • Please refer to the following new API:
    • DL_TimerG_setCaptCompUpdateMethod
• DL_TimerG_getPipelineUpdateMode
  • Please refer to the following new API:
    • DL_TimerG_getCaptCompUpdateMethod
• DL_TimerA_setCaptureCompareValuePipeline
  • PCC register has been removed in production sample. Capture compare update mode is now configured via DL_TimerG_setCaptCompUpdateMethod and DL_TimerG_setLoadValue

dl_timerh

All DL_TimerH APIs have been removed. Since all TimerH instances in the devices were removed and some TIMG instances were updated to be 32-bit timers with no prescale support. Please refer to the MSPM0G and MSPM0L Families: Functional Differences With Early Samples document for additional updates regarding this device level change.

SysConfig Code Generation/GUI Changes

This section shows the differences in the early sample and production sample versions of SysConfig as it relates to the GUI itself and the resulting code generation. Each row shows a code change that reflects an update to the SDK or a change to SysConfig.

Each section’s changes are described in the DriverLib section of the Migration guide and are linked in the title of the section for reference.

System Modules

DMA

Early SysConfig Settings	Production SysConfig Settings

SYSCTL

Early SysConfig Settings	Production SysConfig Settings
	Interrupts Removed
	Interrupts Removed

Communications

I2C

Early SysConfig Settings	Production SysConfig Settings

SPI

Early SysConfig Settings	Production SysConfig Settings

Data Integrity

CRC

Early SysConfig Settings	Production SysConfig Settings
CRC Init Changes	CRC Init Changes

<Application_File>.syscfg comparison

This section highlights the differences between early sample and production sample .syscfg files and how to modify old .syscfg files to be compatible with production samples. Every project contains a .syscfg file that contains all the SysConfig configuration settings that are set via the GUI, and migrating to the latest SDK and SysConfig resulted in changes to certain parameters and functions. Each row reflects a change in the SysConfig GUI/SDK that resulted in a change to parameters. Rather than going through the GUI to make these changes, a user can directly modify this file via text editor to migrate the configuration settings to the latest version.

System Modules

DMA

Early SysConfig Settings	Production SysConfig Settings

SysCtl

Early SysConfig Settings	Production SysConfig Settings
G Device Defines	Settings Deleted
L Device Defines	Settings Deleted

Communications

I2C

Early SysConfig Settings	Production SysConfig Settings

Data Integrity

CRC

Early SysConfig Settings	Production SysConfig Settings
N/A	Optional. if not wanted, just remove line