BIM OAD Off-Chip

Table of Contents

Introduction

The bim_oad_offchip is a small project used with the simple_peripheral project in OAD off-chip configuration; it is not used as a standalone project. It is a lightweight Boot Image Manager (BIM) that resides in the last page of internal flash and executes after the boot ROM. BIM for off-chip OAD is used to determine whether to run the existing application image or to copy a new image or images from off-chip flash to on-chip flash. Use the cc2640r2lp_app-FlashROM_OAD_Offchip configuration of the simple_peripheral application. See the OAD section of the Bluetooth low energy Software Developer’s Guide for more information.

Hardware Prerequisites

The default BIM OAD Off-chip configuration uses the LAUNCHXL-CC2640R2. This hardware configuration is shown in the below image:

For custom hardware, see the Running the SDK on Custom Boards section of the TI Bluetooth low energy Software Developer’s Guide.

Software Prerequisites

For information on what versions of Code Composer Studio and IAR Embedded Workbench to use, see the Release Notes located in the docs/blestack folder. For information on how to import this project into your IDE workspace and build/run, please refer to The CC2640R2F Platform section in the Bluetooth low energy Software Developer’s Guide.

Usage

The usage of this project is explained in the OAD section of the Bluetooth low energy Software Developer’s Guide.

By default, this project uses the following pins to access the SPI flash:

PIN CC2640R2F Pins
IOID_FLASH_CS IOID_20
SPI_MOSI IOID_9
SPI_MISO IOID_8
SPI_CLK_FLASH IOID_10

These can be changed using the procedure described in the OAD Off-Chip section of the Bluetooth low energy Software Developer’s Guide.