1.2. Release Notes - 11_00_00

1.2.1. Introduction

This release notes provides important information that will assist you in using the SDL software package for the J721E family of devices. This document provides the product information and known issues that are specific to the SDL software package.

New features added / supported is listed below and defects fixed are highlighted in Fixed Issues. Also please check Upgrade and Compatibility for backward compatibility

1.2.2. What’s New

  • Bug fixes

  • R5 ECC cache example for performing single error correction (SEC) for MCUR5F0 (In R5 ECC cache currently we are performing only error injection, error detection related things are still pending this will come in next release.)

  • CORE name has been changed from r5f to mcu1_0. This change is made to add support of multicore image for performing testing of R5f related ECC aggregators.

1.2.3. Supported Modules

SDL support for the following modules are available:

  • R5F PMU, MPU, RAT and VIM

  • ESM

  • PBIST

  • LBIST

  • POK

  • VTM

  • TOG

  • ECC

  • RTI

  • R5F CCM

  • DCC

  • MCRC

  • ROM CHECKSUM

Safety Examples for the following modules:

  • ESM

  • POK

  • VTM

  • TOG

  • DCC

  • RTI

  • ECC

  • BIST

  • ROM CHECKSUM

1.2.4. Upgrade and Compatibility

None

1.2.5. Supported Devices

Platform

Supported Devices

Supported EVMs

J721E SR1.1 and SR2.0

Functional safety Devices:
DRA829
TDA4VM
DRA829Vx Evaluation Module
(DRA829VXEVM)

1.2.6. Fixed Defects

ID

Summary

Comments

PROC_SDL-8249

SDL ECC error injection test for CSI ECC aggregators failure

None.

1.2.7. Open Defects

ID

Summary

Workaround

PROC_SDL-6298

sdl_pok_test_app fails for SDL_POK_VMON_EXT_OV_ID instance

None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application.

PROC_SDL-7421

ECC DED test is failing for certain RAM ID’s in SDL_ECC_MEMTYPE_MAIN_MSMSC_AGGR0.

None - This issues is under investigation

PROC_SDL-8258

SDL ECC error injection test for DSS ECC aggregators failure

None - This issue is under investigation. Accessing some DSS ECC Aggregators leads to data abort. Root cause may be hardware configuration and/or pre-test sequence in the application. The IP associated with the ECC aggregator may need some additional power/init sequence.

PROC_SDL-8943

SDL application does not work with safertos BUILD_OS_TYPE

None - This issue is under investigation.

PROC_SDL-8248

SDL ECC error injection test for PCIE ECC aggregators failure

None - This issue is under investigation. Accessing some PCIE ECC Aggregator leads to data abort. Root cause may be hardware configuration and/or pre-test sequence in the application. The IP associated with the ECC aggregator may need some additional power/init sequence.

PROC_SDL-8317

SDL PBIST test is failing for HC instance in PG 2.0 board

None - This issues is under investigation

1.2.8. Migration Information

None

1.2.9. Tool Chain Information

Component

Version

TI ARM R5F Clang Compiler tools

3.2.2.LTS