Imaging Release Notes
Version: 08.05.00
Contents
- Introduction
- Licensing
- Getting Started
- Documentation
- What's New
- Upgrade and Compatibility Information
- Device Support
- Supported Image Sensors PSDK RTOS
- Supported Image Sensors EdgeAI
- Validation Information
- Fixed Issues
- Change Requests
- Known Issues
- Technical Support
- Package Versioning
Introduction
The Imaging package consists of the Texas Instruments OpenVX conformant implementation for J7 EVM platforms
Licensing
The licensing information of this library, as well as any third-party components included which are made available under a number of other open-source licenses are enumerated as part of the manifest. A complete manifest along with export control information is detailed here [HTML].
Getting Started
The Imaging User Guide [HTML] provides the documentation and references necessary to begin development on TI's platforms using Imaging.
Documentation
Refer to following documentation for further details:
Imaging User Guide for J7 | Build instructions, additional information related to J7 platform | [HTML] |
Software Manifest | Licenses, terms of use | [HTML] |
What's New
Here is a list of the new feature(s) supported in this release:
-
Support for VPAC3L.
Added support for ISP live tuning on EdgeAI.
Upgrade and Compatibility Information
Device Support
SoC | HOST (OS) | Target (OS) | Test Plaform |
J7 | x86_64 (Linux) | A72 (Linux) | J721E/J721S2/J784S4 EVM + Fusion board Revision 1C. Older Fusion boards are not supported. |
Supported Image Sensors PSDK RTOS
Image Sensor | Max Instances | Module | Ordering Info |
IMX390 | 8 | D3RCM-IMX390-953 | D3RCM-IMX390-953 |
AR0820 | 1 | MARS (MARS1-TI953-GEVK, MARS1-AR0820AT3B-GEVB) | Please contact OnSemi |
AR0233 | 1 | MARS (MARS1-TI953-GEVK, MARS1-AR0233ATSCS-GEVB) | Please contact OnSemi |
AR0820 | 1 | LI-AR0820-FPDLINKIII | LI-AR0820-FPDLINKIII |
GW5200-AR0233 YUV422 | 1 | LI-GW5200-AR0233 | LI-GW5200-AR0233 |
Supported Image Sensors EdgeAI
Only DCC XML and binary configuartion files are provided in Imaging for the sensors listed below. V4L2 Sensor drivers are provided by Processor SDK Linux.
Image Sensor | Max Instances | Module | Ordering Info |
IMX219 | 1 | Raspberry Pi Camera Module 2 | Raspberry Pi Camera Module 2 |
OV2312 | 1 | LI-OV2312-FPDLINKIII-LED-110H | LI-OV2312-FPDLINKIII-LED-110H |
Validation Information
This release was built and validated using the following tools:
Build Tools (included in Processor SDK RTOS):
- ARM R5F Code Generation Tools version: Same as Processor SDK RTOS
Dependencies (included in Processor SDK RTOS):
- TIOVX version: Same as Processor SDK RTOS
- VXLIB version: Same as Processor SDK RTOS
- Processor SDK RTOS version: 08.05.00
Fixed Issues
- Potential integer overflow in AWB
- Proper initialization of variables in 2A wrapper
Change Requests
- Scope In - None.
- Scope Out - None.
- Scope Modifications - None.
Known Issues
- NTR.
Technical Support
For technical support and additional assistance, contact E2E Forum
Package Versioning
Each package version is composed of 4 period-delimited numbers - represented here by the letters M, m, p and b [M.m.p.b]
. The table below provides a descriptive reference regarding package version numbering.
Digit | Meaning | Description |
---|---|---|
1 (M=Major) | Major revision | Incremented when the new version is substantially different from the previous For example, a new module added or an existing module's algorithm significantly altered. |
2 (m=minor) | Minor revision | Incremented when the new version has changed but not in a major way. For example, some minor changes in the API or feature set. |
3 (p=patch) | Patch number | Incremented for all other source code changes. This include any packaging support code. |
4 (b=build) | Build number | Incremented for each release delivery to CM. Reset for any change to M, m or p |
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