2.1. Release Notes - 00_02_00¶
2.1.1. Introduction¶
This release notes provides important information that will assist you in using the SDL software package for the J721E family of devices. This document provides the product information and known issues that are specific to the SDL software package.
New features added / supported is listed below and defects fixed are highlighted in Fixed Issues. Also please check Upgrade and Compatibility for backward compatibility
2.1.2. What’s New¶
SDL Support to compile with TI ARM Clang Compiler.
SDL Support for the following modules are added:
R5F CCM
DCC
MCRC
SDL Support for the following modules is available from previous release:
ESM
PBIST
LBIST
POK
VTM
TOG
ECC
RTI
Safety Examples for the following modules:
ESM
POK
VTM
TOG
DCC
RTI
ECC
2.1.3. Supported Platforms¶
Platform |
Supported Devices |
Supported EVMs |
|---|---|---|
J721E SR1.1 |
Functional safety Devices:
DRA829
TDA4VM
|
DRA829Vx Evaluation Module
(DRA829VXEVM)
|
2.1.4. Fixed Issues¶
None
2.1.5. Known Issues and Limitations¶
Issue Id |
Description |
Workaround |
|---|---|---|
PROC_SDL-1956 |
PBIST test case for DSS/EDP/DSI fails |
None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application. |
PROC_SDL-1955 |
SDL_PBIST_selfTest for GPU Instance with golden vectors fails |
None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application. |
PROC_SDL-2417 |
SDL ECC error injection test fails for certain IPs (PCIE, SA2UL, DSS/eDP/DSI, CSITX/RX, I3C, UFS0) |
None - This issue is under investigation. Root cause may be hardware configuration and/or pre-test sequence in the application. The IP associated with the ECC aggregator may need some additional power/init sequence. |
2.1.6. Migration Information¶
None
2.1.7. Tool Chain Information¶
Component |
Version |
|---|---|
TI ARM R5F Clang Compiler tools |
1.3.0.LTS |