1. Overview¶
1.1. Introduction¶
The Texas Instruments Platform Development Kit (PDK) is a single scalable software driver package that offers streamlined development on TI’s Processors. The PDK package contains device abstraction layer libraries and peripheral/board level sample/demo examples that demonstrate the capabilities of the peripherals for development, deployment and execution of applications.
The high level block diagram of PDK is shown in below figure.
Fig. 1.1 PDK Block Diagram
1.2. Scope¶
The purpose of this guide is to quickly provide the information you need most while evaluating and developing applications on a TI embedded processor, specifically running embedded real-time operating system. It is not intended to be a thorough design document. As such, the focus is on application programming interfaces (API), build information, and examples to use as a template to start development.
1.3. Technical Support¶
|
For technical support please post your questions at http://e2e.ti.com. |
1.4. TI Disclaimer¶
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, license, warranty or endorsement thereof.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations and notices. Representation or reproduction o f this information with alteration voids all warranties provided for an associated TI product or service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Resale of TI’s products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service, is an unfair and deceptive business practice, and TI is not responsible nor liable for any such use.
Also see: Standard Terms and Conditions of Sale for Semiconductor Products https://www.ti.com/sc/docs/stdterms.htm
Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265