Imaging Release Notes
Version: 08.02.00.00
Contents
- Introduction
- Licensing
- Getting Started
- Documentation
- What's New
- Upgrade and Compatibility Information
- Device Support
- Supported Image Sensors
- Validation Information
- Fixed Issues
- Change Requests
- Known Issues
- Technical Support
- Package Versioning
Introduction
The Imaging package consists of the Texas Instruments OpenVX conformant implementation for J721E EVM platform
Licensing
The licensing information of this library, as well as any third-party components included which are made available under a number of other open-source licenses are enumerated as part of the manifest. A complete manifest along with export control information is detailed here [HTML].
Getting Started
The Imaging User Guide [HTML] provides the documentation and references necessary to begin development on TI's platforms using Imaging.
Documentation
Refer to following documentation for further details:
Imaging User Guide for J7 | Build instructions, additional information related to J7 platform | [HTML] |
Software Manifest | Licenses, terms of use | [HTML] |
What's New
Here are a few of the new features supported in this release:
-
None
Upgrade and Compatibility Information
Device Support
SoC | HOST (OS) | Target (OS) | Test Plaform |
J7 | x86_64 (Linux) | A72 (Linux) | J7 EVM + Fusion board Revision 1C. Older Fusion boards are not supported. |
Supported Image Sensors
Image Sensor | Max Instances | Module | Ordering Info |
IMX390 | 8 | D3RCM-IMX390-953 | D3RCM-IMX390-953 |
AR0820 | 1 | MARS (MARS1-TI953-GEVK, MARS1-AR0820AT3B-GEVB) | Please contact OnSemi |
AR0233 | 1 | MARS (MARS1-TI953-GEVK, MARS1-AR0233ATSCS-GEVB) | Please contact OnSemi |
AR0820 | 1 | LI-AR0820-FPDLINKIII | LI-AR0820-FPDLINKIII |
GW5200-AR0233 YUV422 | 1 | LI-GW5200-AR0233 | LI-GW5200-AR0233 |
Validation Information
This release was built and validated using the following tools:
Build Tools (included in Processor SDK RTOS):
- ARM R5F Code Generation Tools version: Same as Processor SDK RTOS
Dependencies (included in Processor SDK RTOS):
- TIOVX version: Same as Processor SDK RTOS
- VXLIB version: Same as Processor SDK RTOS
- Processor SDK RTOS version: 8.02
Fixed Issues
- ISS-245: Scratch memory is allocated and freed inside tivxAewbProcess callback
- ISS-246: A typo of missing typedef for tivx_aewb_hist_t definition
- ISS-247: Wrong exposure control registers are used in AR0820 driver
Change Requests
- Scope In - None.
- Scope Out - AR0820 8MP @ 36fps support - moved to release 8.04.
- Scope Out - AWB algorithm supporting VPAC3 Dynamic White Balance
- Scope Modifications - None.
Known Issues
- NTR.
Technical Support
For technical support and additional assistance, contact E2E Forum
Package Versioning
Each package version is composed of 4 period-delimited numbers - represented here by the letters M, m, p and b [M.m.p.b]
. The table below provides a descriptive reference regarding package version numbering.
Digit | Meaning | Description |
---|---|---|
1 (M=Major) | Major revision | Incremented when the new version is substantially different from the previous For example, a new module added or an existing module's algorithm significantly altered. |
2 (m=minor) | Minor revision | Incremented when the new version has changed but not in a major way. For example, some minor changes in the API or feature set. |
3 (p=patch) | Patch number | Incremented for all other source code changes. This include any packaging support code. |
4 (b=build) | Build number | Incremented for each release delivery to CM. Reset for any change to M, m or p |
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