Imaging Release Notes

Version: 11.00.00


Contents

  1. Introduction
  2. Licensing
  3. Getting Started
  4. Documentation
  5. What's New
  6. Upgrade and Compatibility Information
  7. Device Support
  8. Supported Image Sensors PSDK Linux + RTOS
  9. Supported Image Sensors PSDK QNX + RTOS
  10. Supported Image Sensors EdgeAI
  11. Supported Image Sensors by Third Party
  12. Validation Information
  13. Fixed Issues
  14. Change Requests
  15. Known Issues
  16. Technical Support
  17. Package Versioning


Introduction

The Imaging package consists of the Texas Instruments OpenVX conformant implementation for J7 EVM and AM6xA EVM platforms


Licensing

The licensing information of this library, as well as any third-party components included which are made available under a number of other open-source licenses are enumerated as part of the manifest. A complete manifest along with export control information is detailed here [HTML].


Getting Started

The Imaging User Guide [HTML] provides the documentation and references necessary to begin development on TI's platforms using Imaging.


Documentation

Refer to following documentation for further details:

Imaging documentation

Imaging User Guide for J7 and AM6xA Build instructions, additional information related to J7 and AM6xA platform [HTML]
Software Manifest Licenses, terms of use [HTML]

Imaging FAQs

Default DCC profile generation tool for TDA4/AM6xA ISP [LINK]
Creating LDC Mesh LUT [LINK]
Creating CAC Mesh LUT [LINK]
Setting up AE for Image Sensor (TDA4/AM6xA ISP) [LINK]
Setting Min/Max Exposure Time and Analog Gain for 2A Algorithm (EdgeAI) [LINK]
Modify and Rebuild TI’s 2A algorithm (AM6xA) [LINK]
How to Debug Wrong VPAC Output Color [LINK]
TDA4VM: VPAC LDC configuration for image flipping [LINK]

Tuning Guides

ISP Tuning Guide for J7/TDA4 Work flow of tuning the ISP related to J7/TDA4 platform [HTML]
ISP Tuning Guide for AM6xA Work flow of tuning the ISP related to AM6xA platform [HTML]

Tuning Tool

Tuning Tool Tuning Tool Request and Download [LINK]

SQA Reports

Static Analysis Report [XLSX]
Test Report [XLSX]
Bidirectional Traceability Report [XLSX]


What's New

Here is a list of the new feature(s) supported in this release:


Upgrade and Compatibility Information

None.


Device Support

SoC HOST (OS) Target (OS) Test Plaform
J7 x86_64 (Linux) A72 (Linux)
  • J721E/J721S2/J742S2/J784S4 EVM + Fusion1 Rev. C and Fusion2 Rev. E1/E3. Older Fusion boards are not supported.
  • J722S + Fusion1 Rev. C and Fusion2 Rev. E3
  • AM6xA x86_64 (Linux) A53 (Linux) AM62A/AM68A/AM69A SK + V3Link Fusion Mini

    Supported Image Sensors PSDK Linux/QNX + RTOS

    Image Sensor Max Instances Supported Platform Module Ordering Info
    IMX390 8
    Note: j784s4 + Fusion2 can support up to 12
    J721E/J721S2/J722S/J742S2/J784S4 EVMs + Fusion1/2 D3RCM-IMX390-953 D3RCM-IMX390-953
    AR0233 1 J721E/J721S2/J722S/J742S2/J784S4 EVMs + Fusion1/2 MARS (MARS1-TI953-GEVK, MARS1-AR0233ATSCS-GEVB) Please contact OnSemi
    AR0820 1 J721E/J721S2/J722S/J742S2/J784S4 EVMs + Fusion1/2 LI-AR0820-FPDLINKIII LI-AR0820-FPDLINKIII
    GW5200-AR0233 YUV422 1 J721E/J721S2/J742S2/J784S4 EVMs + Fusion1/2 LI-GW5200-AR0233 LI-GW5200-AR0233
    IMX390 DesignCore® Discovery Series (55° HFOV, 100° HFOV, 174° HFOV) 4 J721E/J721S2/J722S/J742S2/J784S4 EVMs + Fusion1/2 IMX390 DesignCore® Discovery Series IMX390 DesignCore® Discovery Series
    IMX728 1
  • J784S4 EVM + Fusion2 Rev. E1/E3
  • J722S EVM + Fusion2 Rev. E3
  • D3-IMX728-FPDLINKIV D3-IMX728-FPDLINKIV

    Supported Image Sensors PSDK QNX-only + RTOS

    Image Sensor Max Instances Supported Platform Module Ordering Info
    OV2312 1 SK-AM62A Board + QNX only LI-OV2312-FPDLINKIII-LED-110H LI-OV2312-FPDLINKIII-LED-110H

    Supported Image Sensors EdgeAI

    Only DCC XML and binary configuration files are provided in Imaging for the sensors listed below. V4L2 Sensor drivers are provided by Processor SDK Linux.

    Image Sensor Max Instances Supported Platform Module Ordering Info
    IMX390 4 SK-TDA4VM Board, J722S EVM, SK-AM62A Board, SK-AM68A Board, SK-AM69A Board D3RCM-IMX390-953 D3RCM-IMX390-953
    IMX219 4 SK-TDA4VM Board, J722S EVM, SK-AM62A Board, SK-AM68A Board, SK-AM69A Board Raspberry Pi Camera Module 2 Raspberry Pi Camera Module 2
    OV2312 1 J722S EVM, SK-AM62A Board, SK-AM68A Board, SK-AM69A Board LI-OV2312-FPDLINKIII-LED-110H LI-OV2312-FPDLINKIII-LED-110H
    OV5647 1 SK-TDA4VM Board, SK-AM62A Board OV5647 Sensor for Raspberry Pi Camera OV5647 Sensor for Raspberry Pi Camera
    OX05B 1 SK-AM62A Board LI-OX05B1S-MIPI-137H LI-OX05B1S-MIPI-137H

    Supported Image Sensors by Third Party

    The listed sensors are supported by third-parties.

    Image Sensor Max Instances Module Ordering Info
    IMX623 1 Sony module w/ SR1069A Lens Please contact Sony for SDK 8.1 driver Registration flow | Developer World (sony.com)


    Validation Information

    This release was built and validated using the following tools:

    Build Tools (included in Processor SDK RTOS):

    Dependencies (included in Processor SDK RTOS):

    Refer user guide [HTML] for instructions to install and setup above dependencies.


    Fixed Issues

    ID Summary
    ADASVISION-6315 [J722S/J7AEN] DOF: Display2 with PipeID 1 fails to create
    ADASVISION-6436 Extend multicam support to any channel mask instead of contiguous
    ISS-474 Interpolation method should be configurable from Imaging for VPAC3L
    ISS-606 Switching between IMX390 RCM and IMX390 Disco single-cam app results in error
    ISS-621 Implemented FPD-LinkIV (UB9702 + UB971/UB953) recommneded initializion process
    ISS-773 AR0820 has incorrect camera detection
    ISS-786 Imaging CAC conformance tests for HV-MV


    Change Requests

    1. Scope In - None.
    2. Scope Out - None.
    3. Scope Modifications - None.


    Known Issues

    ID Summary
    ADASVISION-4923 Single cam error on ports other than port 1 after running multi cam
    ADASVISION-6080 Incomplete frame error in multi cam application
    SITSW-3215 DCC live tuning for AWB not working properly on AM62A
    ISS-520 J722S: Starting all but 0 sensor fails


    Technical Support

    For technical support and additional assistance, contact E2E Forum


    Package Versioning

    Each package version is composed of 4 period-delimited numbers - represented here by the letters M, m, p and b [M.m.p.b]. The table below provides a descriptive reference regarding package version numbering.

    Digit Meaning Description
    1 (M=Major) Major revision Incremented when the new version is substantially different from the previous For example, a new module added or an existing module's algorithm significantly altered.
    2 (m=minor) Minor revision Incremented when the new version has changed but not in a major way. For example, some minor changes in the API or feature set.
    3 (p=patch) Patch number Incremented for all other source code changes. This include any packaging support code.
    4 (b=build) Build number Incremented for each release delivery to CM. Reset for any change to M, m or p


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