Vision Apps Release Notes

Version: 11.01.00

Contents

  1. Introduction
  2. Licensing
  3. Getting Started
  4. Documentation
  5. What's New
  6. Device Support
  7. Validation Information
  8. Fixed Issues
  9. Open Defects
  10. Technical Support
  11. Package Versioning


Introduction

The Vision Apps package consists of ADAS, vision, deep learning, perception demos/applications for J722S platform

To run the demos in vision apps, the companion PROCESSOR-SDK-LINUX-J722S also needs to be downloaded separately.


Licensing

Refer to Processor SDK RTOS manifest at top level [HTML]


Getting Started

The Vision Apps User Guide [HTML] provides the documentation and references necessary to begin development on TI's platforms using Vision Apps.


Documentation

Refer to following documentation for further details:

Vision Apps User Guide Build instructions, API Guide [HTML]
Release Notes Archive Previous release notes [FOLDER]


What's New

New features in this release are highlighted in bold


Device Support

Refer Processor SDK RTOS release notes [HTML]

Validation Information

The tools used to validate this package are listed in top level user guide [HTML]


Fixed Issues

ID Summary
ADASVISION-6376 Removal of SKIPBUILD flag from Vision_apps for modules and demos
ADASVISION-6679 [QNX] GCC version of compiler is used in concerto instead of QCC
ADASVISION-6738 [QNX] vx_app_tidl app build broken for debug mode
ADASVISION-6647 MMALIB profile is hardcoded to "release" in linker paths
ADASVISION-6434 SDK Components for RTOS documentation is missing C7x libraries: DSPLIB, FFTLIB, MATHLIB, VXLIB, TISP


Open Defects

ID Summary
ADASVISION-6451 mailbox queue overflowing while running vx_app_arm_ipc.out
ADASVISION-6473 Multi-cam codec app fails on QNX
ADASVISION-6520 [J722S/J7AEN] DOF: Display2 with PipeID 1 fails to create
ADASVISION-6564 Vision app utils: qnx: All thread creation must use default stack instead of global stack
ADASVISION-6621 Memory map tool does not update sysconfig files if addresses change
ADASVISION-6634 make sbl_bootimage fails from top level SDK build


Technical Support

For technical support and additional assistance, contact local TI Field Application Engineer


Package Versioning

Each package version is composed of 4 period-delimited numbers - represented here by the letters M, m, p and b [M.m.p.b]. The table below provides a descriptive reference regarding package version numbering.

Digit Meaning Description
1 (M=Major) Major revision Incremented when the new version is substantially different from the previous For example, a new module added or an existing module's algorithm significantly altered.
2 (m=minor) Minor revision Incremented when the new version has changed but not in a major way. For example, some minor changes in the API or feature set.
3 (p=patch) Patch number Incremented for all other source code changes. This include any packaging support code.
4 (b=build) Build number Incremented for each release delivery to CM. Reset for any change to M, m or p

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