TISP Release Notes

Version: 11.00.00.02

Attention!

  • Features listed below are early versions and should be considered as "experimental".
  • Users can evaluate the feature, however the feature is not fully tested at TI side.
  • TI would not support these feature on public e2e.
  • Experimental features will be enabled with limited examples and SW modules.

  • Contents

    1. Introduction
    2. Licensing
    3. Getting Started
    4. Documentation
    5. What's New
    6. Upgrade and Compatibility Information
    7. Device Support
    8. Validation Information
    9. Fixed Issues
    10. Deprecation
    11. Known Issues
    12. Technical Support
    13. Package Versioning


    Introduction

    The TISP package consists of the Texas Instruments optimized kernels for low-level vision processing algorithms.


    Licensing

    The licensing information of this library and a complete manifest along with export control information is detailed here [HTML].


    Getting Started

    The TISP User Guide [USER_GUIDE] provides the documentation and references necessary to begin development on TI's platforms. Currently, Windows build is not supported.


    Documentation

    Refer to following documentation for further details:

    TISP User Guide Build instructions, API Guide [USER_GUIDE]
    Software Manifest Licenses, terms of use [HTML]


    What's New

  • Added RTOS support to examples
  • Use of smart pointers for creating nodes and opVec - please see examples inside the test folder
  • The test example demonstrate the use of graph create, execute, and destroy functions
  • Added derived-class specific exec member function for various supernode styles - e.g., TISP::SuperNode::i2d_to_o2d has an exec member function

  • Upgrade and Compatibility Information

    File Change description User application change required User application recompile required


    Device Support

    SoC Host (OS) Target (OS) Test Platform
    C7x No OS No OS

    Validation Information

    This release was built and validated using the following tools:

    Build Tools (NOT included in TISP):


    Supported Kernels


    Fixed Issues


    Known Issues

    Technical Support

    For technical support, please post your questions on TI E2E Forum for Processors.

    For additional assistance, contact local TI Field Application Engineer


    Package Versioning

    Each package version is composed of 4 period-delimited numbers - represented here by the letters M, m, p and b [M.m.p.b]. The table below provides a descriptive reference regarding package version numbering.

    Digit Meaning Description
    1 (M=Major) Major revision Incremented when the new version is substantially different from the previous For example, a new module added or an existing module's algorithm significantly altered.
    2 (m=minor) Minor revision Incremented when the new version has changed but not in a major way. For example, some minor changes in the API or feature set.
    3 (p=patch) Patch number Incremented for all other source code changes. This include any packaging support code.
    4 (b=build) Build number Incremented for each release delivery to CM. Reset for any change to M, m or p

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