SDL Release Notes

Table of Contents

Introduction

This release notes provides important information that will assist you in using the SDL software package for the J722S family of devices. This document provides the product information and known issues that are specific to the SDL software package.

New features added / supported is listed below and defects fixed are highlighted in Fixed Defects. Also please check Upgrade and Compatibility for backward compatibility

What’s New

• No change from 11.02.00 release

Supported Modules

SDL support for the following modules are available:

• ESM
• PBIST
• LBIST
• VTM
• ECC
• RTI
• DCC
• MCRC
• MTOG
• STOG
• POK
• ROM CHECKSUM

Upgrade and Compatibility

None

Supported Devices

• Platform: J722S

Fixed Defects

• None

Open Defects

ID	Summary
PROC_SDL-7434	ECC: PCIE ECC aggregator testing not supported
PROC_SDL-8257	ECC: ecc_test_app is failing
PROC_SDL-7608	ECC: SA2_UL0_SA2_UL_SA2_UL_ECC_AGGR testing failures

Migration Information

None

Tool Chain Information

• Component: TI ARM R5F Clang Compiler tools
• Version: 4.0.4 LTS