TIOVX Release Notes

Version: 01.00.00.00


Contents

  1. Introduction
  2. Licensing
  3. Getting Started
  4. Documentation
  5. What's New
  6. Upgrade and Compatibility Information
  7. Device Support
  8. Validation Information
  9. Known Issues
  10. Technical Support
  11. Package Versioning


Introduction

The TIOVX package consists of the Texas Instruments OpenVX conformant implementation.


Licensing

The licensing information of this library, as well as any third-party components included which are made available under a number of other open-source licenses are enumerated as part of the manifest. A complete manifest along with export control information is detailed here [HTML].


Getting Started

The TIOVX User Guide [HTML] provides the documentation and references necessary to begin development on TI's platforms using TIOVX.


Documentation

Refer to following documentation for further details:

TIOVX User Guide Build instructions, API Guide [HTML]
TIOVX Tutorial Guide Step by step tutorials to get started with OpenVX and TIOVX [HTML]
PyTIOVX User Guide OpenVX application code generator tool [HTML]
Test Reports Misra C reports, conformance test reports, TI platform test reports [FOLDER]
Software Manifest Licenses, terms of use [HTML]


What's New

This is the first release of TIOVX. Here are a few of the features supported in this release:

  1. Conformant to OpenVX 1.1 Specification
  2. DMA acceleration through BAM wrapper
  3. Sample EVE iVision kernel integration
  4. Sample Vision SDK camera/display use-case integration
  5. OpenVX tutorial to get started on TIOVX development
  6. Python-based tool for generating OpenVX code


Upgrade and Compatibility Information

This is the first version of TIOVX.


Device Support

SoC HOST (OS) Target (OS) Test Plaform
TDA2x ARM M4 (BIOS) DSP C66x (BIOS)
EVE (BIOS)
ARM A15 (BIOS)
ARM M4 (BIOS)
TDA2x TI EVM
TDA2x ARM A15 (Linux) DSP C66x (BIOS)
EVE (BIOS)
ARM A15 (Linux)
ARM M4 (BIOS)
TDA2x TI EVM
TDA2Ex ARM M4 (BIOS) DSP C66x (BIOS)
ARM A15 (BIOS)
ARM M4 (BIOS)
TDA2Ex TI EVM
TDA2Ex ARM A15 (Linux) DSP C66x (BIOS)
ARM A15 (Linux)
ARM M4 (BIOS)
TDA2Ex TI EVM
TDA3x ARM M4 (BIOS) DSP C66x (BIOS)
EVE (BIOS)
ARM M4 (BIOS)
TDA3x TI EVM

Validation Information

This release was built and validated using the following tools:

Build Tools (included in Vision SDK):

Build Tools (NOT included in Vision SDK, needs to be downloaded separately):

Dependencies (included in Vision SDK):


Known Issues

  1. VXLIB-371: Multiply iS16 iS16 oS16 with 1/255 as scaling factor fails for X86 target
  2. TIOVX-24: Harris Corners test case 206 fails for TDA2 BIOS build when running entire test suite


Technical Support

For technical support, please post your questions on TI E2E Forum for Automotive ADAS SoCs.

For additional assistance, contact local TI Field Application Engineer


Package Versioning

Each package version is composed of 4 period-delimited numbers - represented here by the letters M, m, p and b [M.m.p.b]. The table below provides a descriptive reference regarding package version numbering.

Digit Meaning Description
1 (M=Major) Major revision Incremented when the new version is substantially different from the previous For example, a new module added or an existing module's algorithm significantly altered.
2 (m=minor) Minor revision Incremented when the new version has changed but not in a major way. For example, some minor changes in the API or feature set.
3 (p=patch) Patch number Incremented for all other source code changes. This include any packaging support code.
4 (b=build) Build number Incremented for each release delivery to CM. Reset for any change to M, m or p


Copyright 2017, Texas Instruments Incorporated