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The TIOVX package consists of the Texas Instruments OpenVX conformant implementation.
The licensing information of this library, as well as any third-party components included which are made available under a number of other open-source licenses are enumerated as part of the manifest. A complete manifest along with export control information is detailed here [HTML].
The TIOVX User Guide [HTML] provides the documentation and references necessary to begin development on TI's platforms using TIOVX.
Refer to following documentation for further details:
TIOVX User Guide | Build instructions, API Guide | [HTML] |
TIOVX Tutorial Guide | Step by step tutorials to get started with OpenVX and TIOVX | [HTML] |
PyTIOVX User Guide | OpenVX application code generator tool | [HTML] |
Test Reports | Misra C reports, conformance test reports, TI platform test reports | [FOLDER] |
Software Manifest | Licenses, terms of use | [HTML] |
This is the first release of TIOVX. Here are a few of the features supported in this release:
File | Change description | User application change required | User application recompile required |
include\VX\vx_types.h | Change type of vx_bool to vx_enum instead of enum, since size of enum is compiler dependant | NO | YES |
include\TI\tivx_kernels.h include\TI\tivx_nodes.h |
Moved these files from tiovx\include\TI to tiovx_xx_xx_xx_xx\kernels\include\TI | YES - add tiovx_xx_xx_xx_xx\kernels\ to application include path | YES |
include\TI\tivx.h | Renamed TIVX_MODULE_NAME0 to TIVX_MODULE_NAME_OPENVX_CORE Renamed TIVX_MODULE_NAME1 to TIVX_MODULE_NAME_IVISION Moved TIVX_MODULE_NAME0, TIVX_MODULE_NAME1 to kernels\include\TI\tivx_kernels.h |
YES - include TI\tivx_kernels.h in application in addition to TI\tivx.h | YES |
SoC | HOST (OS) | Target (OS) | Test Plaform |
TDA2x | ARM M4 (BIOS) | DSP C66x (BIOS) EVE (BIOS) ARM A15 (BIOS) ARM M4 (BIOS) |
TDA2x TI EVM |
TDA2x | ARM A15 (Linux) | DSP C66x (BIOS) EVE (BIOS) ARM A15 (Linux) ARM M4 (BIOS) |
TDA2x TI EVM |
TDA2Ex | ARM M4 (BIOS) | DSP C66x (BIOS) ARM A15 (BIOS) ARM M4 (BIOS) |
TDA2Ex TI EVM |
TDA2Ex | ARM A15 (Linux) | DSP C66x (BIOS) ARM A15 (Linux) ARM M4 (BIOS) |
TDA2Ex TI EVM |
TDA3x | ARM M4 (BIOS) | DSP C66x (BIOS) EVE (BIOS) ARM M4 (BIOS) |
TDA3x TI EVM |
This release was built and validated using the following tools:
Build Tools (included in Vision SDK):
Build Tools (NOT included in Vision SDK, needs to be downloaded separately):
Dependencies (included in Vision SDK):
For technical support, please post your questions on TI E2E Forum for Automotive ADAS SoCs.
For additional assistance, contact local TI Field Application Engineer
Each package version is composed of 4 period-delimited numbers - represented here by the letters M, m, p and b [M.m.p.b]
. The table below provides a descriptive reference regarding package version numbering.
Digit | Meaning | Description |
---|---|---|
1 (M=Major) | Major revision | Incremented when the new version is substantially different from the previous For example, a new module added or an existing module's algorithm significantly altered. |
2 (m=minor) | Minor revision | Incremented when the new version has changed but not in a major way. For example, some minor changes in the API or feature set. |
3 (p=patch) | Patch number | Incremented for all other source code changes. This include any packaging support code. |
4 (b=build) | Build number | Incremented for each release delivery to CM. Reset for any change to M, m or p |