SDL Release Notes

Table of Contents

Introduction

This release notes provides important information that will assist you in using the SDL software package for the J7200 family of devices. This document provides the product information and known issues that are specific to the SDL software package.

New features added / supported is listed below and defects fixed are highlighted in Fixed Defects. Also please check Upgrade and Compatibility for backward compatibility

What’s New

• Bug fixes
• Time Profiling for Test Apps

Supported Modules

SDL support for the following modules are available:

• R5F PMU, MPU, RAT and VIM
• ESM
• PBIST
• LBIST
• POK
• VTM
• TOG
• ECC
• RTI
• R5F CCM
• DCC
• MCRC
• ROM CHECKSUM

Safety Examples for the following modules:

• ESM
• POK
• VTM
• TOG
• DCC
• RTI
• ECC
• BIST
• ROM CHECKSUM

Upgrade and Compatibility

None

Supported Devices

• Platform: J7200 / DRA821

Fixed Defects

ID	Summary
PROC_SDL-9004	Issue in LBIST profile timing

Open Defects

ID	Summary
PROC_SDL-6352	SDL ECC error injection for (VC_MAIN_RC_ECC_AGGR4_ECC_AGGR) fails for certain RAM ID's.
PROC_SDL-8286	SDL ECC error injection test for I3C ECC aggregators failure
PROC_SDL-8248	SDL ECC error injection test for PCIE aggregators failure

Migration Information

None.

Tool Chain Information

• Component: TI ARM R5F Clang Compiler tools
• Version: 4.0.4 LTS