TI BLE-Stack 3.02.01.00 Release Notes
Table of Contents
Introduction
SimpleLink™ CC2640R2 Software Development Kit (SDK) delivers components that enable engineers to develop applications on Texas Instruments SimpleLink Bluetooth® low energy CC2640R2F wireless MCU. This powerful software toolkit provides a cohesive and consistent software experience for all SimpleLink CC2640R2 users by packaging essential software components such as the Bluetooth 4.2 protocol stack (BLE-Stack), the Bluetooth 5 protocol stack (BLE5-Stack), TI-RTOS and peripheral drivers in one easy-to-use software package along with exhaustive documentation.
As with all Bluetooth core specifications that support the low energy (LE) feature, devices implementing the LE feature of Bluetooth 5 are backward compatible with Bluetooth 4.2, 4.1 and 4.0 LE capable devices.
BLE-Stack 3.02.01.00 is production release and a maintenance update to BLE-Stack 3.02.00.xx
Additional information about TI’s Bluetooth low energy solutions can be found at www.ti.com/ble
BLE-Stack Documentation
The SimpleLink CC2640R2 SDK allows easier product development by combining the TI-RTOS and BLE protocol stack in one unified SDK. All BLE-Stack sample applications are based off the TI-RTOS Kernel. Key documents needed for BLE application development include:
What’s New
| ID | Summary |
|---|---|
| BLESTACK-4068 | TOF Passive: Application |
| BLESTACK-4067 | TOF Initiator: Support Multinode & GUI Composer |
| BLESTACK-2860 | New features: ATT retransmission module |
Fixed Issues
| ID | Summary |
|---|---|
| BLESTACK-4212 | Fixed the issue when Secure On-chip BIM for CC2640R2 failed to reject image with invalid signature |
| BLESTACK-4153 | ToF: after several seconds the initiator stops to show data on the terminal in not connected mode |
| BLESTACK-4140 | AoA: in connected receiver does not show AoA values after stop/start sending AoA |
| BLESTACK-4065 | Fixed the issue where TGAP_CONN_HIGH_SCAN_INT/WIND were not used during highDutyCycle link establishment |
| BLESTACK-4040 | Fixed the issue where L2CAP reassembly did not occur |
| BLESTACK-3999 | Fixed the issue where ECC workzone could cause stack overflow in BIM and Secure_FW projects |
| BLESTACK-3975 | Fixed compiler errors when using non-default board files |
| BLESTACK-3604 | IAR BLE simple peripheral project drops BLE connection within ~40 seconds using a Samsung S6 with OS v7.0 |
| BLESTACK-3580 | When using simple_peripheral with multiple connections, an issue can occur when parameter update requests will not get applied, resulting in dropped connections |
| BLESTACK-3246 | Failure to send Terminate Ind when Update Param Request is pending |
| BLESTACK-3219 | Peripheral+Observer build configuration in simple_peripheral application missing patches that can cause no symbol file to be generated |
| BLESTACK-2760 | In rare cases, the GAP state of the Peripheral is set to advertising without any actual packets being sent |
| BLESTACK-2453 | Link Layer Connection Parameters Request Procedure may not work with some smart phone devices. |
Known Issues and Limitations
| ID | Summary |
|---|---|
| BLESTACK-4263 | BIM reserves extra pages of flash when not using secure OAD |
| BLESTACK-4193 | Known issue where an incoming Slave Security Request not handled properly by the GapBondMgr and will trigger a new pair |
| BLESTACK-3934 | L2CAP recombination failing in some cases when data length update combines with L2CAP packet |
| BLESTACK-3641 | L2CAP Connection Oriented Channels are not available in multi-role configurations |
| BLESTACK-3640 | Number of simultaneous connections may be limited when attempting concurrent LE Secure Connections pairings |
| BLESTACK-2706 | Multi-role incorrectly sets gapRole_AdvEnabled when enabling non-connectable advertisements. |
Installation and Usage
- To build the sample applications with this SDK a supported a supported IDE must be installed (refer to Dependencies below)
- Install the simplelink_cc2640r2_sdk_2_30_00_28.exe package on a Windows® 7 SP1, Windows 8.1 or Windows 10 machine with Administrator privileges
- The default install path is C:\ti\simplelink_cc2640r2_sdk_2_30_00_28 and is referenced as $BLE_INSTALL$ in the documentation
- Changing the default install path and/or drive letter may require updating project variables. Do not use a space in the install path
- It is recommended to make a backup of the installation in order to revert modifications to the SDK
Upgrade and Compatibility Information
The CC2640R2 SDK uses a new directory & file format which differs from BLE-Stack 2.2.x and earlier SDK releases. Existing applications developed with earlier SDKs require porting to this release; however, most BLE APIs remain the same thus reducing the effort required to migrate to this release. Refer to the Migration Guide for details.
Operating System Support
The BLE-Stack sample applications in the CC2640R2 SDK are supported on the Microsoft Windows® 7 SP1, Windows 8.1 or Windows 10 build platform.
Dependencies
The BLE-Stack sample applications were built & tested with the following Integrated Development Environments (IDEs) and listed components on Windows 7 SP1 and Windows 10 host build platforms.
Device Support
This release supports single-mode Bluetooth LE on the following SimpleLink wireless MCUs:
Note: This SDK does not support SimpleLink CC2640/CC2650/CC1350 devices or development kits with these devices.
Development Board Support
This release supports Bluetooth low energy applications on the following development kit: CC2640R2 LaunchPad
Validation
TI BLE-Stack 3.02.01.00 was tested using the following components:
- C Compiler for IAR: EWARM-${IAR_VERSION}
- C Compiler for ARM: ${CCS_VERSION}
- XDCTools: ${XDC_VERSION}
- CC2640R2 LaunchPad
This release is for evaluation and development purposes only. End products being developed with this protocol stack version will require a future update prior to obtaining Bluetooth and/or regulatory certification.
Versioning
This product follows a version format, M.mm.pp.bb, where:
- M is a 1 digit major number,
- mm is a 2 digit minor number,
- pp is a 2 digit patch number,
- bb is a 2 digit incrementing build counter.