SimpleLink™ CC13x2_26x2 SDK 3.10.01.11 Release Notes
Table of Contents
Introduction
The SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13x2 and CC26x2 family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13x2 and CC26x2 wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5, Thread 1.1 networking stack based on OpenThread, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI’s 15.4 Stack as well as the TI-RTOS kernel and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU through time division multiplexing.
The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.
This is version 3.10.01.11 of the SimpleLink CC13x2 / CC26x2 SDK. This is an updated SDK which adds software support for the first production ready version of the CC1352P SimpleLink™ multi-band wireless MCU with integrated power amplifier. All other software feature content remains the same as the previous SimpleLink CC13x2 / CC26x2 3.10.00.53 SDK.
Documentation
What’s New
CC1352P
- Added production RF settings for the CC1352P wireless MCU and related LaunchPad™ development kits: LAUNCHXL-CC1352P1 and LAUNCHXL-CC1352P-2. See Known Issues section below for important information regarding this update.
Bluetooth 5 (BLE5-Stack)
- Initial Bluetooth 5 qualified release for production
- Support for SysConfig added in IAR projects
Thread (TI-OpenThread)
- Thread 1.1 certification updated to include CC1352R and CC1352P devices
- Performance improvements for native OAD
- IAR IDE can now be used for Thread example development
- Example projects now have a power test build configuration.
TI 15.4-Stack
- The messaging layer for the TI 15.4-Stack examples have been updated with NoICall libraries, saving 5 KB of flash.
- Secure commissioning enables security features based on the crypto driver including secure key exchange, device authentication and key generation.
- Support for on-chip OAD
- All TI 15.4-Stack example projects support SysConfig
Dynamic Multi-protocol Manager
- New policy table structure including a new policy option - Balanced Mode.
- New Zigbee router + BLE peripheral example.
Zigbee (TI Z-Stack)
- Zigbee PRO 2017 (R22) and Green Power Proxy v1.1.1 certified stack (Z-Stack Core v1.0.0.0)
- Zigbee Cluster Library (ZCL) 7 integration
- Example projects now have a power test build configuration.
- All Zigbee example projects support SysConfig
SysConfig
- SmartRF Settings are fully configurable in SysConfig.
- SysConfig GUI configuration tool now allows configuration of protocol stacks.
Updated CoreSDK component to version 4.10.03.00. The CoreSDK is comprised of the TI-RTOS SYS/BIOS kernel, DriverLib and TI Drivers.
Refer to the Document Overview for the individual release notes and details for starting development with each SDK component
Refer to the included Change Log for a summary of new features and fixed issues since the last SDK release
Upgrade and Compatibility Information
- This is the first production ready version of the software for the CC1352P device.
- This release contains new settings for the CC1352P1 and CC1352P-2 LaunchPad development boards.
- For CC1312R, CC1352R, CC2642R and CC2652R users, this SDK is identical to the previous SimpleLink CC13x2/CC26x2 3.10.00.53 SDK release.
- Projects that do not use SysConfig will be deprecated in the future. You can find a SysConfig Migration guide in each stack User’s Guide.
Operating System Support
- Windows® 7 SP1, Windows 8.1, Windows 10
- Ubuntu 14.04 64-bit, Ubuntu 16.04 64-bit
- macOS Mojave
Dependencies
SimpleLink CC13x2 / CC26x2 SDK 3.10.01.11 was built & tested on a Windows host platform using the following Integrated Development Environments (IDEs) and components. Using an IDE or toolchain version not listed below may result in compatibility issues with this SDK release. Refer to the individual component release notes in the Document Overview for each component’s supported code generation tools.
- IAR Embedded Workbench: EWARM-8.32.2
- TI Code Composer Studio: CCS-9.0.0.00013
- TI Code Generation Tools for Arm: 18.12.1.LTS
- XDCTools: 3.51.02.21
- SysConfig Standalone tool for IAR IDE: 1.0.655
Device Support
This SDK supports the following SimpleLink CC13x2 and CC26x2 wireless MCUs with silicon revision E:
Development Board Support
Please see the LaunchPad User Manual for more information on using the individual LaunchPads:
Known Issues
A required radio override to ensure reliable operation when using the high power PA is missing. Without this override, the device may in some cases hang or reset. In the next SDK release (SimpleLink CC13x2 / CC26x2 SDK 3.20) this override will be included for all example projects. For proper operation, follow the instruction outlined on this link https://e2e.ti.com/support/wireless-connectivity/zigbee-and-thread/f/158/t/802791.
- For 2.4 GHz operation on CC1352P, it is not possible to dynamically switch between the high power PA and the normal PA at runtime. Make sure you are only using one of the following TX power ranges:
- 15 to 20 dBm (using the high power PA) or
- -20 to 5 dBm (using the normal PA)
If a change of PA is required, it is recommended to reset the device.
For all SDK components, the importing of IAR projects through dev.ti.com is currently unsupported
Refer to the Document Overview for known issues and limitations as published in each SDK component’s release notes
Versioning
This product follows a version format, M.mm.pp.bb, where:
- M is a 1 digit major number,
- mm is a 2 digit minor number,
- pp is a 2 digit patch number,
- bb is a 2 digit incrementing build counter.