AES 1.2.5.1 Release Notes

June 14, 2012

Introduction, License, Standard, and Export Control Information Known Issues, Documentation, What's New, Upgrade and Compatibility Information, Host Support, Device Support, Validation Information, Benchmarks, Versioning, Technical Support and Product Updates


Introduction

The AES component provides block cipher encryption and decryption for little and big endian c64x+ processors. The component supports key sizes of 128, 192, and 256 bits; input text in 128 bit blocks and output text in 128 bit blocks.

back to top


License, Standard, and Export Control Information

License Information:

Standards Information:

Export Control Information:

back to top


Known Issues

None.

back to top


Documentation

The following documentation is available:

Release notes from previous releases are also available in the relnotes_archive directory.

back to top


What's New

Current Changes

The following changes have been made in release 1.2.5.1:

Previous Changes

The following changes have been made in release 1.2.5.0:

The following changes have been made in release 1.2.4.0:

The following changes have been made in release 1.2.3.0:

The following changes have been made in release 1.2.2.0:

The following changes have been made in release 1.2.1.0:

The following changes have been made in release 1.1.0.0:

The following changes have been made in release 1.0.0.2:

Release 1.0.0.1 provided the following:

Release 1.0.0.0 provided the following:

back to top


Upgrade and Compatibility Information

Warning: Beginning with AES 1.0.0.2 the aes_a.a* library for c64x+ LE and BE implementations is no longer provided. This library has had its name reverted back to aes_c.a* with the upgrade to the new XDC toolset.

This ti.mas.aes version is not backward compatible with the last released version. The compatibility key has been changed from 2.0.0.0 -> 3.0.0.0. This package follows a new packaging standard which is incompatible with previous version as the Version definition has been changed from V.R.X.P --> M.m.X.P.

Please note that the package compatibility keys are independent of XDC product release numbers.

Package compatibility keys are intended to:

  1. Enable tooling to identify incompatibilities between components, and
  2. Convey a level of compatibility between different releases to set end user expectations.

Package compatibility keys are composed of 4 comma-delimited numbers - M, S, R, P - where:

back to top


Host Support

The current XDC toolset can be used to build components on the following hosts:

back to top


Device Support

This release supports the following device families:

back to top


Validation Information

This release was built and validated using the following components:

Component Dependencies

AES

AES Test Simulation

Tool Dependencies for Source Release

back to top


Benchmarks

The following benchmarks were taken for this release:

back to top


Versioning

This product's version follows a version format, M.m.x.p, where M is a single digit Major number, m is single digit minor number, x is single digit vertical numbner and p is a single digit patch number

Please note that version numbers and compatibility keys are NOT the same. For an explanation of compatibility keys, please refer to the 'Upgrade and Compatibility Information' section.

back to top


Technical Support and Product Updates

Contact local TI Field Application Engineer for technical support.

back to top


Copyright 2012, Texas Instruments Incorporated