Texas
Instruments
SimpleLink™ Bluetooth®
low energy protocol stack |
Mar 28, 2018
This is version 2.2.2 of the TI Bluetooth® low energy protocol stack (BLE-Stack) Software Development Kit (SDK). The BLE-Stack SDK allows for the development of single-mode Bluetooth low energy (BLE) applications on TI’s first generation SimpleLink Bluetooth low energy CC2640 and Multi-Standard CC2650 wireless microcontroller units (MCUs) supporting version 4.2 of the Bluetooth specification. The CC26x0 family of wireless MCUs includes a 32-bit Arm® Cortex™-M3 as the main application CPU running at 48 MHz, a dedicated Cortex-M0 processor for the radio / Physical Layer (PHY), and an autonomous Sensor Controller Engine for low-power sensing applications. The BLE protocol stack is built on top of the TI Real-time Operating System (TI-RTOS) which provides advanced power management and flexible peripheral driver capabilities allowing the development of highly optimized & power efficient standalone or network processor applications. The TI-RTOS SDK is installed during the BLE-Stack SDK installation.
Version 2.2.2 of the BLE-Stack is a maintenance update to TI’s existing royalty-free Bluetooth low energy software protocol stack which includes support for all core specification version 4.2 Low Energy (LE) features as well as several development kits. This protocol stack update is in addition to support of all major Bluetooth LE core specification version 4.1 features, including support for up to 8 master or slave BLE connections. A few examples of what can be created using the sample applications in this SDK and/or the additional resources found in the Examples section below include Bluetooth beacons incorporating the popular Apple iBeacon® and Eddystone™ formats, glucose, heart rate and fitness monitors, dongles for cable replacement via a BLE Serial Port Bridge and industrial motor monitors.
See What's New below for an overview of new features in this release. The Bluetooth core specification version 4.2 features supported in this release allow development of the most secure and power efficient products incorporating the Bluetooth low energy specification.
This
document is divided into the following sections:
The
BLE-Stack SDK contains the following components:
SDK Path |
Description |
blelib |
BLE
protocol stack code provided in library form (i.e.
Host, Controller, etc.) |
sap_3_01_00_01 |
Simple
Application Processor (SAP) libraries & documentation for interfacing to
the Simple Network Processor (SNP) |
docs |
Included
documentation (see below) |
examples\<kit>
|
Sample
applications, organized by evaluation kit (see supported kits below) |
examples\hex
|
Prebuilt
hex firmware files for selected sample applications |
examples\util |
Boot
Image Manager (BIM) sample applications for OAD |
src |
Source
code used by sample application & stack projects |
tools |
Tools
used for build and debug (libsearch, frontier,
BTool) |
The
following documents are included in the ‘docs’ folder. Document links
assume the SDK is installed locally at the default install path.
Document |
Description |
SWRU393_CC26x0_BLE_Software_Developer's_Guide.pdf |
BLE
Software Developer’s Guide for developing applications with this SDK.
Newer version may be online by referencing the literature ID: SWRU393 |
CC26x0
Simple Network Processer API Guide.pdf |
API
Guide for interfacing to the Simple Network Processor (SNP). Located in the
sap_3_00_01_07\docs folder. |
CC2640 BLE OAD User's
Guide.pdf |
Reference
guide for implementing firmware upgrade using the TI Over the Air Download
(OAD) profile on supported applications |
TI_BLE_Vendor_Specific_HCI_Guide.pdf |
Network
Processor Vendor Specific API reference guide for the HostTest
project |
TI-RTOS
Kernel & Driver documentation overview page (local installation) |
2.2.2
2.2.1
2.2.0
2.1.1
2.1.0
2.0.0
The full procedure for building applications with this SDK is described in Section 2.6 Setting up the Development Environment of the included SWRU393_CC2640_BLE_Software_Developer’s_Guide. A supported IDE is required. Refer to the Dependencies section below for a list of supported IDEs.
Download and run the BLE-Stack V2.2.2 SDK installer on a Windows® 7, 8.1 or 10 host build platform machine: ble_sdk_2_02_02_xx_setup.exe, where ‘xx’ is the build revision number. By default, the BLE-Stack SDK will be installed to:
c:\ti\simplelink\ble_sdk_2_02_02_xx and referred to as $BLE_INSTALL$ in the documentation.
Changing the default installation path or drive may require a manual update to environment variables used by sample application projects; refer to the SWRU393_CC2640_BLE_Software_Developer’s_Guide for more details. TI recommends making a backup of the SDK installation prior to development. The above installer includes the TI-RTOS SDK installer which will be automatically launched during the installation process. The included TI-RTOS installation is required for developing applications with the BLE-Stack SDK.
Please see the available sample applications located in
\examples\<kit> as a starting point for using the BLE-Stack SDK to
develop a BLE application. The SWRU393_CC2640_BLE_Software_Developer’s_Guide uses the Simple BLE
Peripheral (simple_peripheral) sample application
found in \examples\cc2650lp\simple_peripheral as a guide. Additional software
examples and getting started material are provided in the
“Examples” section below.
TI-RTOS
version 2.21.01.08 default installation path:
C:\ti\tirtos_cc13xx_cc26xx_2_21_01_08
XDC
Tools 3.32.00.06 default installation path: C:\ti\xdctools_3_32_00_06_core
The
BLE-Stack 2.2.x SDK uses a new directory and file format from previous
BLE-Stack 2.1.x and earlier SDK releases. Existing applications developed with
earlier SDKs require porting to this release. Refer to the SWRU393_CC2640_BLE_Software_Developer’s_Guide and online
porting guide on the TI BLE Wiki: www.ti.com/ble-wiki.
The SDK was built & tested with the following Integrated Development Environments (IDEs) and components on a Windows 7 host platform. Using another IDE version or TI-RTOS installation not listed below may result in compatibility issues with this SDK release.
TI-RTOS
version 2.20.01.08
The following IDEs are supported by this SDK:
IDE |
Version |
Tool Chain |
Notes |
Code
Composer Studio (CCS) |
7.4.0
(Build 15 or later) |
TI ARM Compiler 16.9.4.LTS |
Other compiler versions may not compatible with this SDK.
Refer to Section 2.6.3 Code Composer Studio in
the SWRU393_CC2640_BLE_Software_Developer’s_Guide for the procedure to
install TI ARM Compilers versions not included with CCS. |
IAR
Embedded Workbench for ARM |
7.80.4 |
Included |
A time limited evaluation version may be available. Please note the fully functional (non size-limited) version of IAR is required. |
BTool is accessed at \tools\btool and can be launched from the SDK Start Menu (Start -> Texas Instruments -> SDK). The cc2650lp_host_test_rel.hex prebuilt firmware can be flashed to the CC2650 LaunchPad for use with the BTool PC application via the LaunchPad’s USB connection.
This release supports Bluetooth low energy on the following SimpleLink CC26x0 wireless MCUs: CC2640 and CC2650 in all package configurations. The multi-standard CC2650 wireless MCU supports Bluetooth LE as well as other wireless protocols, such as ZigBee®, RF4CE and 6LoWPAN. The CC2640 supports Bluetooth LE only and is suitable for designs that only require Bluetooth LE connectivity. All code generated from the BLE-Stack v2.x SDK is binary compatible and exchangeable with both the CC2650 and CC2640 wireless MCUs in the same device package configuration. All TI CC26x0 development kits feature the CC2650 which can be used for development & prototyping of CC2640 based designs. No changes to the IDE project’s device CPU settings are required when using this SDK to generate code for the CC2640 or CC2650 wireless MCUs.
The following development kits are supported by this SDK
release:
Kit Name |
SDK Name |
Description |
cc2650lp |
Full
BLE evaluation, development & prototyping kit with integrated XDS110
debugger. Support for optional BoosterPack™
accessories, such as an LCD. Getting started demo with Project Zero. Can be used as a
standalone debugger for custom board development. |
|
cc2650bp |
CC2650 Module BoosterPack plug-in module for evaluating the CC2650MODA BLE module in standalone or network processor applications. Compatible with the MSP432™ LaunchPad. Get started with network processor development using SimpleLink Academy. |
|
cc2650stk |
IoT demonstration platform with multiple MEMS sensors. Some
sample applications require the Debugger DevPack
for programming. SensorTags produced after June
2017 do not include the TMP007 IR temperature sensor. |
|
cc2650rc |
Voice
remote control featuring a digital mic, IR emitter, MEMS motion sensor and
more. Additional information can be found on TI’s Remote Control page. |
|
cc2650em |
Development
kit with integrated XDS100v3 debugger and support for pluggable CC2650EM
evaluation modules. Includes LCD & buttons. Default module used for SDK
sample applications is the CC2650EM_7ID (7x7 package). |
Development
kits not listed above are considered experimental.
This release is a production version. Refer
to the TI BLE Wiki “How
to certify your product” page for details regarding Bluetooth
certification and how to reduce Bluetooth certification time by using
TI’s Qualified
Design ID (QDID).
· Sample applications are included in this SDK. Additional software examples, application notes, reference designs & guides may be found on the TI BLE Wiki and the SimpleLink GitHub page.
· Use SimpleLink Academy workshops with Project Zero to quickly get started with BLE development, including creating your custom profile with TI’s plugin for Bluetooth Developer Studio
· Sensor Controller Studio can be used to develop applications for the embedded Sensor Controller Engine.
· TI Designs™ Reference library with complete Bluetooth low energy system designs, such as the UART to BLE Bridge.
· Use of other TI Compiler versions in CCS may not be compatible with this SDK. Refer to Section 2.6.3 “Code Composer Studio” in the SWRU393_CC2640_BLE_Software_Developer’s_Guide for the procedure to install TI ARM Compiler versions not included with CCS. Refer to the Updating CCS wiki guide for additional details.
· Use of a whitespace in a CCS workspace path will cause build failures
· Number of simultaneous connections may be limited when attempting concurrent LE Secure Connections pairings. Suggested workaround is to perform LE Secure Connections pairing on an individual connection basis.
· Use of Privacy 1.2 features with legacy BT4.1 peer devices may cause connection stability issues
This is SDK version 2.2.2. The included .revision
file contains revision tracking identifiers.
For
more information, visit www.ti.com. Web links
may not be valid after release.
LaunchPad,
BoosterPack, TI Designs, SimpleLink, Code Composer
Studio, SmartRF, BLE-Stack are trademarks of Texas
Instruments.
ARM, Cortex are registered trademarks of ARM
Limited.
CCS
Cloud is a trademark of Apalia LLC.
iBeacon is a trademark of Apple Inc.
Bluetooth
is a registered trademark of Bluetooth SIG.
Eddystone
is a trademark of Google Inc.
Windows
7 is a registered trademark of Microsoft Inc.
Copyright
2010 – 2018 Texas Instruments, Inc.